Chip structure

Abstract

In the present invention, a chip structure, suitable to be used in radar applications is provided. Said chip structure comprises, at least one gallium based first layer (1) to perform RF applications;at least one gallium based second layer (2), placed on said first layer (1), to perform digital applications; at least two copper based pillars (3) located between the first layer (1) and the secondlayer (2), which provide electrical connection between the first layer (1) and second layer (2) and which ensure that there is a safe distance between the first layer (1) and second layer (2).

Description

technical field [0001] The present invention relates to a chip structure particularly suitable for phased array radar applications. Background technique [0002] Phased array radars consist of multiple receiving and / or transmitting modules and antennas, which must be separated by a certain distance imposed by the wavelength. Depending on the operating frequency band, the distance between modules must be small. In phased-array radar applications, different tasks (such as sending a signal, receiving a signal, processing a signal, etc.) are performed almost simultaneously. Due to the limited space available per microwave module and the high number of assigned tasks, the chips used in the modules need to be small in size. Furthermore, the chip's brittle nature limits the maximum chip size in handling. Most silicone-based semiconductor technologies are compatible with analog, digital, and RF circuits, so it is possible to form a silicone-based compact multi-channel chip with b...

AI Technical Summary

Problems solved by technology

However, silicon-based technologies are limited by certain key RF performance (noise figure, output power, etc.) compared to other semiconductor technologies such as Gallium Arsenide

Although GaAs-based technology has better RF performance, its integrity is lower than Silicon-based technology, which increases chip size to unacceptable levels

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