Dust removing device for copper plate of integrated circuit

A technology of integrated circuit and dust removal device, which is applied in the field of integrated circuit copper plate dust removal device, can solve the problems of secondary dust and other problems, achieve the effect of comprehensive dust removal, avoid copper plate wear, and reduce friction

Inactive Publication Date: 2020-05-22
重庆市和鑫达电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention intends to provide an integrated circuit copper plate dust removal device to solve the problem that brush dust removal and wind dust removal are easy to generate secondary dust in the prior art

Method used

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  • Dust removing device for copper plate of integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as figure 1 As shown, the integrated circuit copper plate dedusting device includes a frame on which a processing table 1 is horizontally installed, and a mounting frame 4 is vertically welded on both sides of the processing table 1. Symmetric centerline symmetrical setting. The mounting frame 4 is rotatably connected with a spiral dust removal roller 3, and the dust removal roller 3 is made of silica gel. The space between the bottom of the dust removal roller 3 and the processing table 1 is the space for placing the copper plate 2. After the copper plate 2 is put into the space, the dust removal roller 3 can be in contact with the copper plate 2. The top of the cleaning roller 3 is equipped with a spiral dust-staining roller 5 that can mesh with the cleaning roller 3. The dust-staining roller 5 is rotatably connected to the installation frame 4. The surface of the dust-staining roller 5 is provided with an adhesive layer. Shaft eccentric setting. The dust-clea...

Embodiment 2

[0044] The difference between this embodiment and Embodiment 1 is that several feeding rollers (not shown) are rotatably installed on the processing table 1, the surfaces of the feeding rollers are flush, and each feeding roller is covered with a silicone sleeve. In this way, when the copper plate 2 slides on the processing table 1, it can push the feed roller to rotate, thereby changing the sliding friction between the copper plate 2 and the processing table 1 to the rolling friction between the copper plate 2 and the feed roller, reducing the friction force and avoiding Copper plate 2 is worn.

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PUM

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Abstract

The invention relates to the technical field of circuit board processing, in particular to a dust removing device for a copper plate of an integrated circuit. The dust removing device comprises a processing table, wherein a spiral dust removing roller made of silica gel is rotationally arranged above the processing table, the dust removing roller can be in contact with the copper plate, a spiral dust sticking roller capable of being engaged with the dust removing roller is arranged above the dust removing roller, an adhesive layer is arranged on the surface of the dust sticking roller, and a pushing mechanism for intermittently pushing the copper plate is arranged on the processing table. The dust removing device can solve the problem that in the prior art, secondary flying dust is easy togenerate due to brush dust removal and wind dust removal.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to an integrated circuit copper plate dust removal device. Background technique [0002] The circuit board can be called a printed circuit board or a printed circuit board, which can make the circuit miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] The production of circuit boards is usually to cut the copper foil substrate into a size suitable for processing and production. Before the substrate is laminated, it is usually necessary to roughen the copper foil on the surface of the board by brushing, micro-etching, etc., and then Appropriate temperature and pressure will stick the dry film photoresist on it. Send the substrate with dry film photoresist into the ultraviolet exposure machine for exposure, the photoresist will undergo polymerization reaction after ...

Claims

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Application Information

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IPC IPC(8): B08B1/02B08B13/00
CPCB08B13/00B08B1/50B08B1/20
Inventor 胡荣华
Owner 重庆市和鑫达电子有限公司
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