A waveguide type photodetector and its manufacturing method
A technology of photodetector and manufacturing method, which is applied in photovoltaic power generation, semiconductor device, final product manufacturing, etc., can solve the problems of decreased absorption coefficient and the inability of Ge detectors to meet short-wave infrared applications, so as to improve transmission efficiency and improve light detection. The effect of efficiency
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Embodiment 1
[0039] An embodiment of the present application provides a waveguide photodetector.
[0040] figure 1 It is a three-dimensional schematic diagram of the waveguide photodetector of the present embodiment, figure 2 yes figure 1 A schematic cross-sectional view viewed in the A-A' direction of .
[0041] Such as figure 1 and figure 2 As shown, the waveguide photodetector 1 includes:
[0042] The first insulating layer 12 located on the surface of the substrate 11; the lower contact layer 13 located on the surface of the first insulating layer 12; the photoelectric conversion layer 14 located on the surface of the lower contact layer 13, the material of the photoelectric conversion layer 14 includes germanium (Ge); The upper contact layer 15 on the surface of the photoelectric conversion layer 14; the silicon nitride waveguide 16 formed above the first insulating layer 12, the silicon nitride (SiN) waveguide 16 extends in a lateral direction parallel to the surface of the su...
Embodiment 2
[0060] Embodiment 2 provides a method for manufacturing a waveguide photodetector, which is used to manufacture the waveguide photodetector described in Embodiment 1.
[0061] image 3 is a schematic diagram of the manufacturing method of the waveguide photodetector of the present embodiment, such as image 3 As shown, in this embodiment, the manufacturing method may include:
[0062] Step 301, forming a lower contact material layer 13a on the surface of the first insulating layer 12 on the surface of the substrate 11;
[0063] Step 302, forming a photoelectric conversion layer 14 on the surface of the lower contact material layer 13a, and forming an upper contact layer 15 on the surface of the photoelectric conversion layer 14, wherein the material of the photoelectric conversion layer 14 includes germanium (Ge);
[0064] Step 303, etching the lower contact material layer 13a to form the lower contact layer 13;
[0065] Step 304, forming a second insulating layer 17 surrou...
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