Curable silicone composition and optical semiconductor device

A silicone composition and silicon atom bonding technology, applied in semiconductor devices, semiconductor/solid-state device parts, electrical solid-state devices, etc., can solve problems such as insufficient light extraction efficiency and changes in light extraction efficiency

Pending Publication Date: 2020-06-02
DUPONT TORAY SPECIALTY MATERIALS KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that optical semiconductor devices manufactured using these curable silicone compositions are disadvantageous in that the light extraction efficiency is insufficient and the light extraction efficiency changes over time

Method used

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  • Curable silicone composition and optical semiconductor device
  • Curable silicone composition and optical semiconductor device

Examples

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example

[0090] The curable silicone composition and the optical semiconductor device of the present invention are described in more detail below by means of examples and comparative examples. It should be noted that the viscosity refers to the value at 25°C. The following components were used to prepare the curable silicone compositions of the Examples and Comparative Examples. In the formula, Me, Ph, Vi, and Ep represent a methyl group, a phenyl group, a vinyl group, and a 3-glycidoxypropyl group, respectively.

[0091] The following components were used as component (A). (a1) A methylphenylpolysiloxane having two molecular chain ends terminated by dimethylvinylsiloxy groups, which has the following average formula:

[0092] ViMe 2 SiO(MePhSiO) 23 SiMe 2 Vi

[0093] and the following average composition formula:

[0094] Me 1.08 Ph 0.92 Vi 0.08 SiO 0.96

[0095] Expressed (phenyl content = 44.2mol%)

[0096](a2) Dimethyldiphenylpolysiloxane having two molecular chain end...

example 1-6、 comparative example 1 and 2

[0156] Curable silicone compositions were prepared using the compositions shown in Table 1. It should be noted that in Table 1, "SiH / Vi" represents the sum of moles of silicon atom-bonded hydrogen atoms in component (B) per 1 mole of the sum of vinyl groups of component (A). The characteristics of the curable silicone compositions and the characteristics of optical semiconductor devices manufactured using these compositions are also shown in Table 1.

[0157] [Table 1]

[0158]

[0159] *Component (c4) used in Comparative Examples 1 and 2 in the table does not have a siloxane unit represented by the formula: ViSiO 3 / 2

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Abstract

To provide a curable silicone composition whereby an optical semiconductor device can be formed that has good efficiency of light extraction from a light-emitting element and a small rate of change, and an optical semiconductor device having good efficiency of light extraction from a light-emitting element and a small rate of change over time. The curable silicone composition including at least: (A) an organopolysiloxane represented by an average composition formula and having at least two alkenyl groups in the molecule thereof; (B) an organopolysiloxane having at least two silicon-atom-bondedhydrogen atoms in the molecule thereof, at least 5 mol% of silicon-atom-bonded groups other than hydrogen atoms being aryl groups; (C) an organopolysiloxane represented by an average unit formula andhaving an alkenyl group, an aryl group, and an epoxy-containing organic group; and (D) a hydrosilylation catalyst.

Description

[technical field] [0001] The present invention relates to a curable silicone composition and an optical semiconductor device manufactured using the composition. [Background technique] [0002] The curable silicone composition forms a cured product having excellent transparency, electrical insulation, heat resistance, and weather resistance when cured, and is thus useful as an electric / electronic part sealant, adhesive, and coating. Examples of such curable silicone compositions are curable silicone compositions comprising: organopolysiloxanes having alkenyl and phenyl groups; organopolysiloxanes having one or more silicon-bonded hydrogen atoms per molecule; Silicone; [0003] Organopolysiloxanes having epoxy-containing organic groups and alkenyl groups; [0004] and a hydrosilylation catalyst (refer to Patent Document 1); and [0005] A curable silicone composition comprising: an organopolysiloxane having at least 2 alkenyl groups per molecule, wherein at least 30 mole pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05H01L23/29H01L23/31
CPCH01L23/29H01L23/31H01L2924/181H01L2224/73265H01L2224/48091C08L83/04C08G77/12C08G77/20C08G77/14C09D183/04C08G77/80H01L2924/00012H01L2924/00014C08L83/00C08K5/56C08G77/04C08G77/08C08G77/48H01L23/296C08G77/70C08L2203/206C08L2205/025C08L2205/03C08L2205/035H01L33/56
Inventor 饭村智浩西嶋一裕Y·朴
Owner DUPONT TORAY SPECIALTY MATERIALS KK
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