Block hole-type pressureless sintering silicon carbide heat-exchange module and process thereof
A technology of sintered silicon carbide and heat exchange modules, which is applied in the field of engineering ceramic materials, can solve the problems of O-ring sealing instability, increased production costs, broken tube leakage, etc., to achieve reliable sealing, improve performance, and avoid breakage Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0018] Such as figure 1 As shown, it is a block-hole type pressureless sintered silicon carbide heat exchange module, which includes a sintering unit, and the sintering unit is a lower plate 1, a horizontal grid 2, a middle plate 3, and a vertical grid 4 from bottom to top. , Upper board 5. The horizontal grid bars 2 and the vertical grid bars 4 are all provided with several and arranged at a certain distance, and the borders of the horizontal grid bars 2 and the vertical grid bars 4 are all provided with side bars 6 . In this embodiment, the width of the side bars 6 is greater than the widths of the horizontal grid bars 2 and the vertical grid bars 4 .
[0019] Adhesives are arranged on the upper and lower surfaces of the above-mentioned horizontal lattice strips 2, vertical lattice strips 4, and side strips 6 to facilitate bonding and sintering. Such as figure 2 As shown, a plurality of sintered units are combined to form a block-hole pressureless sintered silicon carbid...
Embodiment 2
[0021] The preparation process for the block hole type pressureless sintered silicon carbide heat exchange module in Example 1 includes the following steps: (1) Manufacturing the pressureless sintered silicon carbide green body, the lower plate, the horizontal grid, the middle plate, the vertical grid The blanks of strips and upper plates are manufactured separately;
[0022] (2) Manually coat the bonding material on the upper and lower sides of the horizontal grid, side strips, and vertical grids, with a coating thickness of 0.3-0.6 mm, and apply the , the upper plate and the side strips are assembled;
[0023] (3) Place the assembled block-hole silicon carbide green body into a vacuum furnace for sintering, the sintering atmosphere is argon, the sintering temperature is 2000-2200°C, and the holding time is 0.5-3h;
[0024] (4) After the sintering is completed, continue to place it in a vacuum furnace for annealing treatment. The annealing atmosphere is nitrogen, the tempera...
Embodiment 3
[0027] It is a small-hole heat exchanger of 1 square meter, and the cross-sectional area of the hole channel is 4*28.7=118mm 2
[0028]
[0029] The above is a statistical table of the sintered size and the sintered size data of an embodiment according to the process of embodiment 2.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com