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A kind of flexible circuit board and loudspeaker

A technology of flexible circuit boards and conductive layers, which is applied in the direction of printed circuits, printed circuits, printed circuit components, etc., can solve the failure of metal high cycle fatigue fracture of conductive layer, affect the service life of flexible circuit boards, and the failure of metal high cycle fatigue fracture and other problems to achieve the effect of avoiding metal high cycle fatigue fracture failure, large shear stress, and multiple torsional deformation

Active Publication Date: 2020-08-04
SHANDONG GETTOP ACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing flexible circuit board is tested for reliability and durability, the conductive layer inside the cantilever is prone to metal high-cycle fatigue fracture failure
Because the flexible circuit board will have three combined deformations of pulling, bending and twisting during deformation, the fatigue of the conductive layer is more sensitive to torsion, and the bending part of the cantilever of the flexible circuit board mainly occurs torsional deformation when it vibrates. The conductive layer inside the bending part of the board cantilever bears a large torque and the corresponding shear stress is greater. Therefore, the conductive layer of the bending part of the flexible circuit board cantilever is more prone to metal high cycle fatigue fracture failure
[0004] In addition, the width of the insulating layer of the existing flexible circuit board wrapping the conductive layer is only 0.075 mm larger than the width of the conductive layer. In the area subjected to bending or stretching, such a material structure has little effect on the fatigue of the conductive layer, but it is not affected by the fatigue of the conductive layer. In the area of ​​the cantilever bending part of the flexible circuit board, the shear stress is gradually reduced from the outer edge to the inner edge of the cantilever, and the thickness of the insulating layer at the inner edge of the cantilever is thinner and the strength is lower, so the conductive layer there is sheared The distribution area of ​​stress increases, which makes the conductive layer in the bending part of the cantilever more prone to torsional fatigue failure, which in turn affects the service life of the entire flexible circuit board

Method used

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  • A kind of flexible circuit board and loudspeaker
  • A kind of flexible circuit board and loudspeaker
  • A kind of flexible circuit board and loudspeaker

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1: as figure 1 and figure 2As shown, a flexible circuit board includes a vibration part fixed to the voice coil and a fixed part fixed to the basin frame, the vibration part and the fixed part are connected by a cantilever, and the flexible circuit board is composed of multiple material layers A composite multilayer structure or a multilayer structure composed of multiple material layers and glue layers; the material layer includes an insulating layer 1 and a conductive layer 2, the insulating layer 1 includes an insulating film layer and a glue layer, and the insulating film The layer and the conductive layer 2 can be bonded with an adhesive layer; the insulating layer 1 can also only include an insulating film layer, and the conductive layer 2 is directly formed on the insulating layer 1 . The width of the insulating layer 1 is greater than the width of the conductive layer 2; the conductive layer 2 is located in the middle of the insulating layer 1; the ...

Embodiment 2

[0045] Embodiment 2: as image 3 As shown, a flexible circuit board, in this embodiment, the first reinforcement layer 5 is provided only on the upper side of the inner edge portion 12 of the bent part 3, so that the inner conductive layer 2 of the bent part 3 can be subjected to a smaller force on the upper side. shear stress, thereby increasing the fatigue life limit of the conductive layer 2, thereby increasing the life of the flexible circuit board.

[0046] The first reinforcement layer 5 may be provided only on the lower side of the inner edge portion 12 of the bent portion 3 . In this embodiment, the thickness of the first reinforcement layer 5 is 1.5 times the thickness of the edge portion 12, and the first reinforcement layer 5 is located on the upper or lower side of the inner edge portion 12 of the bending portion 3, and the first reinforcement layer 5 is provided. The thickness of the edge portion 12 inside the bent portion 3 is three times the thickness of the ed...

Embodiment 3

[0048] Embodiment 3: as Figure 4 and Figure 5 As shown, a flexible circuit board includes a cantilever, and the cantilever includes a bent part 3 and extension parts 4 located at both ends of the bent part 3, and the insulating layer 1 of the bent part 3 includes a cover for covering the conductive layer 2 part 11 and an edge part 12 extending outward from the cover part 11 to form an edge part 12 located outside the cover part 11, and the insulating layer of the curved part 3 also includes a width gradually widened from the inner edge part 12 of the curved part 3 from both ends to the middle. Formed arc segment 6, the arc segment 6 is starting from the tangent point between the curved portion 3 and the extension portion 4, its width gradually increases, and the radius of curvature of the curve decreases gradually. The width at the widest part of the arc section 6 is 0.5 times of the width of the extension part 4, and the width at the widest part of the arc section 6 can al...

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PUM

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Abstract

The invention provides a flexible circuit board, a multi-layer structure composed of multiple material layers or a multi-layer structure composed of multiple material layers and glue layers; the material layer includes an insulating layer and a conductive layer, and the insulating layer The width of the flexible circuit board is greater than the width of the conductive layer; the flexible circuit board includes a cantilever, and the cantilever includes a bent part and an extension part located at both ends of the bent part, and the insulating layer of the bent part includes a covering part for covering the conductive layer and extending from the covering part to the outside Extending to form an edge portion located outside the covering portion, the width of the covering portion is equal to the width of the conductive layer, and a first reinforcement layer is arranged on the outer surface of the inner edge portion of the bending portion; the thickness of the edge portion is increased, and the inner strength of the bending portion is improved. Rigidity and strength, and the first reinforcement layer can bear more torsional deformation and shear stress, reduce the torque and shear stress borne by the bending part of the cantilever, effectively avoid the metal high cycle fatigue fracture failure of the conductive layer, and improve the life of the flexible circuit board .

Description

technical field [0001] The invention relates to the technical field of acoustics, in particular to a flexible circuit board and a loudspeaker. Background technique [0002] The super-linear speaker can greatly improve the space utilization rate and the vibration amplitude of the sound-generating device. Therefore, its sound quality, especially the low-frequency sound quality, can be greatly improved. In order to improve the vibration amplitude of the super-linear speaker vibration component, it is necessary to replace the traditional lead It is replaced by a flexible circuit board to conduct the circuit, and has the effect of increasing the amplitude and suppressing the polarization of the dome. [0003] When the existing flexible circuit board is tested for reliability and durability, the conductive layer inside the cantilever is prone to metal high-cycle fatigue fracture failure. Because the flexible circuit board will have three combined deformations of pulling, bending ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H04R9/06H04R9/02
CPCH04R9/02H04R9/025H04R9/06H05K1/028H05K1/0281H05K2201/2009
Inventor 张永华邱士嘉杨长江何宪龙
Owner SHANDONG GETTOP ACOUSTIC