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Array substrate and preparation method thereof

An array substrate and via hole technology is applied in the field of array substrates and their preparation, which can solve the problems of large diameter of shallow holes and inability to combine exposures, and achieve the effects of improving aperture ratio, high leveling, and enhancing contrast.

Active Publication Date: 2020-06-09
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an array substrate and its preparation method to solve the problem that the exposure between the deep hole and the shallow hole on the PFA in the array substrate in the prior art cannot be taken into account, resulting in the excessive diameter of the shallow hole after subsequent etching And other issues

Method used

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  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof

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Embodiment Construction

[0034] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied by many different forms of invention embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned herein.

[0035] In the drawings, components with the same structure are denoted by the same numerals, and components with similar structures or functions are denoted by similar numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of parts is appropriately exaggerated in some ...

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Abstract

The invention provides an array substrate and a preparation method thereof. The array substrate comprises a thin film transistor structure layer, a first via hole and a second via hole, wherein the thin film transistor structure layer is provided with at least one metal wire; and the first via hole and the second via hole respectively extend from the surface of the thin film transistor structure layer to the surface of one metal wire. According to the preparation method of the array substrate, the diameter of a first light-transmitting area, which corresponds to the first via hole, on a mask plate is designed according to the overexposure specification, so that the problem that the diameter of a deep hole and the diameter of a shallow hole are inconsistent after exposure and etching in theprior art is solved.

Description

technical field [0001] The invention relates to the display field, in particular to an array substrate and a preparation method thereof. Background technique [0002] As consumers have higher and higher requirements for liquid crystal display devices, TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-Liquid Crystal Display) is gradually developing in the direction of large size, high resolution, and curved surface display. As the size of the liquid crystal display device increases, defects such as uneven display brightness (Mura) caused by poor uniformity of the cell gap of the liquid crystal cell will become more obvious. Therefore, in the manufacturing process of large-scale liquid crystal display panels, the substrate on which the thin film transistors have been formed usually needs to be covered with a transparent PFA (Polymer Film on Array, organic film on the array substrate side) layer to replace the second passivation layer to Change the smo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77H01L23/522G02F1/1362G02F1/1368
CPCH01L27/1214H01L27/124H01L23/5226H01L27/1259H01L27/1296G02F1/1362G02F1/1368
Inventor 赵迎春
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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