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Manufacturing method of imbricate assembly and imbricate assembly

A component and solar cell technology, applied in the manufacture of shingled components and the field of shingled components, can solve the problems of weak connection ability, low production efficiency and high environmental requirements, and achieve the effects of easy operation, low cost and high efficiency

Pending Publication Date: 2020-06-09
CHENGDU YEFAN SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most serious is the occurrence of current virtual connection or even open circuit. The main reason is generally that the connection ability between materials is weak after combination.
The weak connection ability is mainly manifested in the fact that the conductive adhesive operation in the manufacturing process requires a process operation window. In the actual production process, this window is relatively narrow and is very susceptible to environmental factors, such as the temperature and humidity of the workplace, and the time spent in the air after the glue is applied. The length and so on will make the conductive glue lose its activity
At the same time, uneven sizing and lack of sizing are prone to occur due to changes in the characteristics of the glue under dispensing, spraying or printing processes, which will have great hidden dangers to product reliability.
Secondly, the conductive adhesive is mainly composed of polymer resin and a large amount of precious metal powder, which is expensive and destroys the ecological environment to a certain extent (the production and processing of precious metals are more polluting to the environment)
Furthermore, the conductive adhesive is a paste, which has a certain degree of fluidity during the glue sizing or lamination process, and it is very easy to overflow the glue and cause a short circuit between the positive and negative poles of the shingled interconnected battery string.
[0007] That is to say, for most of the shingled components made of conductive adhesive bonding, there are problems such as weak interconnection strength, high environmental requirements for the process, easy short-circuit of the process using glue overflow, high cost of use, and low production efficiency.

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  • Manufacturing method of imbricate assembly and imbricate assembly

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Embodiment Construction

[0055] Referring now to the accompanying drawings, specific embodiments of the present invention will be described in detail. What is described here is only a preferred embodiment of the present invention, and those skilled in the art can think of other ways to realize the present invention on the basis of the preferred embodiments, and the other ways also fall within the scope of the present invention.

[0056] The invention provides a method for manufacturing a shingled assembly and the shingled assembly, Figure 1 to Figure 3 Preferred embodiments of the present invention are shown.

[0057] In a preferred embodiment, the shingled assembly includes an encapsulation structure and a cell array located in the encapsulation structure. The packaging structure can also include a top plate, a top-side film, a bottom plate and a bottom-side film, wherein the top-side film is located on the top surface of the cell array and is in direct contact with the cell array, the top plate c...

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Abstract

The invention relates to a manufacturing method of an imbricate assembly and an imbricate assembly. According to the manufacturing method, in a lamination step, solar cells are arranged on a bottom side film in an imbricated manner, so that the adjacent solar cells are in conductive connection through the direct contact of main grid lines; the bottom side film and / or a top side film are / is heatedso that at least part of the bottom side film and / or the top side film can be in a molten state and make contact with the solar cells when being in the molten state, and therefore an molten-state areacan be fixed to the solar piece after being solidified. According to the manufacturing method of the technical schemes of the invention, the solar cells can be fixed on the bottom side film through the heating melting characteristic of thermoplastic films without additionally using an adhesive. With the manufacturing method adopted, an arrangement process and a lamination process can be combinedinto one process, the cells are directly laminated and arranged on the bottom side packaging material, and therefore, the manufacturing method has the advantages of low cost, high efficiency and easiness in operation.

Description

technical field [0001] The invention relates to the field of energy, in particular to a method for manufacturing a shingled assembly and the shingled assembly. Background technique [0002] With the accelerated consumption of conventional fossil energy such as coal, oil, and natural gas around the world, and the continuous deterioration of the ecological environment, especially the increasingly severe global climate change caused by greenhouse gas emissions, the sustainable development of human society has been seriously threatened. Countries around the world have formulated their own energy development strategies to deal with the limitation of conventional fossil energy resources and the environmental problems brought about by their development and utilization. Solar energy has become one of the most important renewable energy sources due to its reliability, safety, extensiveness, longevity, environmental protection, and resource adequacy, and is expected to become the main...

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Application Information

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IPC IPC(8): H01L31/048H01L31/18
CPCH01L31/048H01L31/18Y02E10/50Y02P70/50
Inventor 孙俊尹丙伟倪孙洋陈登运丁二亮李岩石刚谢毅刘汉元
Owner CHENGDU YEFAN SCI & TECH CO LTD