Heater structure, preparation method thereof and hydrogen sensor

A heating structure and heater technology, applied in the direction of heating element materials, ohmic resistance heating parts, material resistance, etc., can solve the problems of small heater structure size, bad influence of heating structure detection accuracy, difficulty in forming the shape of resistance structure, etc. , to achieve the effect of reducing the difficulty of forming, improving the detection accuracy, and improving the accuracy

Pending Publication Date: 2020-06-12
SAIC MOTOR
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Problems solved by technology

[0004] However, since the size of the heater structure is very small, usually on the order of hundreds of microns, and the size of the resistance in the heater structure is even smaller, it is difficult to form an accurate resistance when using a screen printing process to prepare the resistance structure in the heater structure. The shape of the structure has a bad influence on the detection accuracy of the heating structure

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  • Heater structure, preparation method thereof and hydrogen sensor
  • Heater structure, preparation method thereof and hydrogen sensor
  • Heater structure, preparation method thereof and hydrogen sensor

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Embodiment Construction

[0044] References to Heater Structures in the Prior Art figure 1 and figure 2 , figure 1 It is a top view structural schematic diagram of a heater structure in the prior art, figure 2 is a schematic cross-sectional structure diagram of a heater structure in the prior art, Figure 3-Figure 5 It is a schematic diagram of the preparation process of the heater structure. First, an initial wafer is provided as the substrate 10; an insulating film 20 is deposited on the substrate 10, and then a pattern of the heating structure 30 is printed on the insulating film 20 by a screen printing process, so that The heating structure includes a first pad 31, a second pad 32 and a resistance wire 33 connecting the first pad 31 and the second pad 32; finally, the back side of the substrate 10 is etched to form a through holes.

[0045] However, as mentioned in the background technology, since the size of the heater structure itself is very small, on the order of hundreds of microns, refe...

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Abstract

The invention discloses a heater structure, a preparation method thereof and a hydrogen sensor. An insulating film layer of the heater structure comprises a second pattern; the height of the second pattern is smaller than that of other areas of the insulating film layer; a formation region is defined for the heating structure formed in the second pattern, therefore, whenthe heating structure is prepared by utilizing a silk-screen printing process, only the conductive paste forming the heating structure needs to be printed in the second pattern, the forming difficulty of the heating structure is reduced, the shape precision of the formed heating structure is improved, the situation that the heating structure obtained through silk-screen printing is much larger than a designed pattern is avoided, and the detection precision of the heater structure is improved.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and more specifically, to a heater structure, a preparation method thereof, and a hydrogen sensor. Background technique [0002] Hydrogen is a clean energy, and the combustion product is water, which does not pollute the environment. Moreover, the calorific value of hydrogen ranks first among all kinds of fuels, more than three times that of petroleum, and its storage volume is small. At the same time, hydrogen resources are abundant, and water is used as raw material, which can be produced by electrolysis, which is relatively abundant compared with chemical fuels. At room temperature, the nature of hydrogen is stable, and it is not easy to react with other substances, but when heated or encountered with a catalyst, it has greater activity. For example, when the hydrogen gas fraction is 4%-75%, it can cause explode. Hydrogen is not easy to store and transport safely. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/02H05B3/16G01N27/16
CPCG01N27/16H05B3/02H05B3/16
Inventor 宁文果王锦王帅楚延鹏沙华露高咏冯奇
Owner SAIC MOTOR
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