Production process of film-coated LED display module and film-coated LED display module

A display module and production process technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of difficulty in ensuring the level of the circuit board, yellowing stress, low production efficiency, etc., and achieve easy large-scale production, harmful gases. The effect of less and high production efficiency

Pending Publication Date: 2020-06-19
广东三橙电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In this packaging method, since there are a large number of electronic components on the back of the circuit board (the side facing away from the LED lamp beads), it is difficult to ensure the level of the circuit board when the circuit board is clamped by a clamp, and the circuit board is distributed due to the distribution of LED lamp beads. And electronic components are easy to bend and deform under the action of gravity and cannot guarantee the level, which will lead to uneven spacing between the release film / release paper and the circuit board, that is, the thickness of the formed adhesive layer is uneven, which affects product quality
[0009] In addition, in the existing encapsulation methods, epoxy resin or silicone material is usually used for encapsulation. They each have their own advantages. For example, epoxy resin has strong waterproof and moisture-proof ability, but its anti-ultraviolet ability is very poor. Under the 2000mW purple light for 72 hours, it will be seriously yellowed; and its stress is large, and it is easy to cause serious quality damage to the product under high and low temperature cycles; packaging with silicone materials can solve the problem of yellowing and stress. Problem, but the oxygen permeability caused by the molecular structure of silica gel is very poor, and water vapor can easily penetrate into the interior, which cannot achieve moisture resistance
Moreover, regardless of the solutions using these two materials, high temperature curing is required after packaging, the curing time is long, and a large amount of harmful gas will be released, so there are disadvantages such as high cost and low production efficiency, and it cannot be produced on a large scale, and it is easy to pollute the environment
For this reason, the inventor of the present application proposes a kind of production process, the circuit board, solid light-transmitting glue layer, light-transmitting film are stacked successively, wherein the melting point of the light-transmitting glue layer is lower than the melting point of the light-transmitting film, when heated to When the light-transmitting adhesive layer melts but the light-transmitting film does not melt, pressure is applied to press the three together. After the light-transmitting adhesive layer is cooled to re-solidify, subsequent processing can be carried out. Although there is no need to wait for a long time for the glue to solidify, the production efficiency is improved. However, the process of cooling and solidification will take a certain amount of time, and the production efficiency needs to be further improved

Method used

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  • Production process of film-coated LED display module and film-coated LED display module
  • Production process of film-coated LED display module and film-coated LED display module
  • Production process of film-coated LED display module and film-coated LED display module

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Experimental program
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Effect test

Embodiment 1

[0053] A film-coated LED display module production process provided in this embodiment includes steps:

[0054] Place the circuit board 2 equipped with LED lamp beads 2.2, the solid light-transmitting adhesive layer 3, and the light-transmitting film 4 in sequence, wherein the side of the circuit board 2 equipped with LED lamp beads 2.2 faces the light-transmitting adhesive layer 3; the light-transmitting adhesive Layer 3 contains light-curable adhesive, and / or both sides of the light-transmitting adhesive layer 3 are coated with light-curable adhesive;

[0055] Apply pressure to the stacked circuit board 2, light-transmitting adhesive layer 3, and light-transmitting film 4 under a preset temperature environment to obtain a film-coated LED display module;

[0056] After the film-coated LED display module is irradiated and cured, the film-coated LED display module is trimmed according to product requirements;

[0057] Wherein, the melting point of the transparent film 4 is hig...

Embodiment 2

[0079] Compared with the first embodiment, the main difference of this embodiment is that the placement sequence of the circuit board, the light-transmitting adhesive layer, and the light-transmitting film is different, and the principles and advantages thereof are the same as those of the first embodiment.

[0080] A film-coated LED display module production process provided in this embodiment includes steps:

[0081] Place the circuit board 2 equipped with LED lamp beads 2.2, the solid light-transmitting adhesive layer 3, and the light-transmitting film 4 in sequence, wherein the side of the circuit board 2 equipped with LED lamp beads 2.2 faces the light-transmitting adhesive layer 3; the light-transmitting adhesive Layer 3 contains light-curable adhesive, and / or both sides of the light-transmitting adhesive layer 3 are coated with light-curable adhesive;

[0082] Apply pressure to the stacked circuit board 2, light-transmitting adhesive layer 3, and light-transmitting film...

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Abstract

The invention provides a production process of a film-coated LED display module and the film-coated LED display module. The technology comprises the steps of sequentially arranging a circuit board provided with LED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film in a stacked mode, wherein the light-transmitting adhesive layer comprises light curing glue; applying pressure in a preset temperature environment to obtain a film-coated LED display module; and after irradiation curing is conducted on the film-coated LED display module, trimming the film-coated LEDdisplay module according to product requirements. The melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer; the preset temperature is higher thanthe melting point of the light-transmitting adhesive layer and lower than the melting point of the light-transmitting film; the film-coated LED display module comprises a circuit board, the light-transmitting adhesive layer and the light-transmitting film; the melting point of the light-transmitting adhesive layer is lower than that of the light-transmitting film; the light-transmitting adhesive layer contains light-curing adhesive, and / or the two sides of the light-transmitting adhesive layer are / is coated with the light-curing adhesive; the process and the display module can ensure that thethickness of the formed adhesive layer is uniform everywhere, and are simple in process, high in production efficiency, low in cost and environment-friendly.

Description

technical field [0001] The invention relates to the technical field of display modules, in particular to a production process of a film-coated LED display module and a film-covered LED display module. Background technique [0002] With the continuous development of the light-emitting diode display industry, the light-emitting diode device has changed from the original DIP structure to the chip structure at a high speed. The light-emitting device with the chip structure has the advantages of light weight, smaller individual, automatic installation, large light-emitting angle, uniform color, and low attenuation. Such advantages are more and more accepted by people. Although general chip light-emitting devices have the above advantages, they still have low mechanical strength, low moisture resistance, low reliability, poor weather resistance, and poor impact resistance. Climate changes in different regions are easy to cause Cracking, deformation, and yellowing problems, especia...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L25/075H01L33/56
CPCH01L25/0753H01L33/56H01L2933/005
Inventor梁高华邓赞红李科刘智勇李徽阳
Owner广东三橙电子科技有限公司