A device and method for measuring the collision process in high-speed laser shock forming of plates

Abstract

The invention discloses a device and method for measuring the collision process in laser shock high-speed forming of plates, belonging to the field of measurement technology. The device includes a laser forming system and a measuring system. The laser forming system includes optical glass, laser, absorbing layer, metal sheet, metal round rod, barrier film, insulating paper and die; The thin plate and the metal round rod are not in direct contact. The metal sheet and the metal round rod are respectively connected to the positive and negative poles of the power supply. After the metal sheet is deformed by the laser shock and touches the metal round rod, the measurement circuit is turned on. The number of times the high-speed moving metal sheet collides with the metal mold, and the width of the voltage pulse is the time of collision contact. The method and device can accurately measure the collision process in the high-speed laser shock forming of the plate. The device of the invention has potential market application prospects.

Description

Technical field: [0001] The invention belongs to the technical field of measurement, and in particular relates to a measuring device and method for the number of collisions and the contact time of collisions between a plate and a forming mold under the action of high-energy substances, and is especially suitable for the high-speed forming process of a plate under laser impact. The method is to measure the collision process between the plate and the mold. Background technique: [0002] At present, laser shock forming has been widely used. The high strain rate laser shock forming technology has greatly improved the plasticity of materials that are difficult to form at room temperature, and can realize the forming of complex shapes of materials that are difficult to form at room temperature such as titanium alloys. Laser shock forming belongs to high-speed forming, and has a remarkable feature: the plate obtains kinetic energy and momentum from the laser-induced high-pressure s...

AI Technical Summary

Problems solved by technology

However, due to the extremely short period of contact between the plate and the mold, the impact occurs at the bottom of the cavity

Due to the occlusion of the mold, it is impossible for the existing VISAR laser velocity interferometer to measure the velocity of the plate movement and deformation from the bottom direction of the mold, let alone measure the contact time of collision and the number of collisions

Since the light pipe that transmits the laser pulse is placed in front of the mold when the laser induces a shock wave, there is no place for the VISAR laser velocity interferometer, and the high-pressure plasma generated by laser irradiation gathers in the mold cavity for a short time, which also blocks the The measurement laser pulses from VISAR make it difficult to reach the surface of the deformed sheet

At present, it is difficult to have ready-made tools to measure the time and number of collisions between the plate and the mold when the plate is bonded during the laser shock process

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