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High-purity nickel plating method for copper disc

A high-purity nickel-plating technology, applied in the field of nickel-plating on copper discs, can solve the problems of insufficient nickel purity, complex operation and processing, unfavorable environmental protection requirements, etc., and achieve the effect of improving purity, improving purity, and shortening production cycle

Inactive Publication Date: 2020-06-26
广汉龙润科贸有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing copper plate nickel plating method is complex in operation and processing, which is not conducive to environmental protection requirements. At the same time, the purity of nickel is not high enough, which makes the service life short

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A high-purity nickel-plated copper disc method comprises the following steps:

[0028] (1) Preparation before plating: mark and deburr the copper substrate, and then polish it with gauze;

[0029] (2) Mechanical degreasing: remove the oil stain on the copper substrate by ultrasonic cleaning, the pH is 8.5, the temperature is 70°C, and the time is 85s;

[0030] (3) Upper hanger and chemical degreasing: put the upper hanger on the copper plate substrate into the 843-II chemical degreasing tank with a concentration of 22g / l of the bath liquid. The pH in the chemical degreasing tank is 8.8 and the temperature is 48°C. Chemical degreasing is 240s;

[0031] (4) Cleaning: wash the copper substrate with running water twice, the water temperature is 45°C, and the cleaning time is 50°C;

[0032] (5) Anodic electrolysis: Add alkaline solution to hot water, perform anodic electrolysis, electrolytic degreasing and / or wax removal on the copper plate substrate, and then spray and cl...

Embodiment 2

[0038] A high-purity nickel-plated copper disc method comprises the following steps:

[0039] (1) Preparation before plating: mark and deburr the copper substrate, and then polish it with gauze;

[0040] (2) Mechanical degreasing: remove the oil stain on the copper substrate by ultrasonic cleaning, the pH is 8.8, the temperature is 60°C, and the time is 88s;

[0041] (3) Upper hanger and chemical degreasing: put the upper hanger on the copper plate substrate into the 843-II chemical degreasing tank with a concentration of 28g / l of the bath liquid. The pH in the chemical degreasing tank is 8.3 and the temperature is 50°C. Chemical degreasing is 320s;

[0042] (4) Cleaning: wash the copper substrate with flowing water twice, the water temperature is 55°C, and the cleaning time is 55s;

[0043] (5) Anodic electrolysis: Add alkaline solution to hot water, perform anodic electrolysis, electrolytic degreasing and / or wax removal on the copper substrate, and then spray and clean it ...

Embodiment 3

[0049] A high-purity nickel-plated copper disc method comprises the following steps:

[0050] (1) Preparation before plating: mark and deburr the copper substrate, and then polish it with gauze;

[0051] (2) Mechanical degreasing: remove the oil stains on the copper substrate by ultrasonic cleaning, the pH is 9.1, the temperature is 63°C, and the time is 91s;

[0052] (3) Upper hanger and chemical degreasing: put the upper hanger on the copper plate substrate into the 843-II chemical degreasing tank with a concentration of 36g / l of the bath liquid. The pH in the chemical degreasing tank is 8.5 and the temperature is 53°C. Chemical degreasing is 260s;

[0053] (4) Cleaning: wash the copper plate substrate twice with flowing water, the water temperature is 48°C, and the cleaning time is 66s;

[0054] (5) Anodic electrolysis: add alkaline solution to hot water, perform anodic electrolysis, electrolytic degreasing and / or wax removal on the copper plate substrate, and then spray ...

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Abstract

The invention relates to a high-purity nickel plating method for a copper disc, and relates to the technical field of copper plate surface treatment. The method comprises the following steps of (1) preparation before plating; (2) mechanically removing oil; (3) loading on a hanger, and chemically removing oil; (4) cleaning; (5) conducting anode electrolysis; (6) conducting acid electrolysis; (7) pre-plating nickel; (8) thickening; and (9) drying. According to the method, eight tedious procedures such as activation are reduced to the original process degree, the production period is shortened, the cost is saved, and the efficiency is improved; and plating nickel is conducted, specifically, an acidic electrolyzed copper plate matrix is placed in a nickel pre-plating solution for nickel pre-plating, and thickening is conducted, specifically, a nickel pre-plated composite material is placed in a nickel-plating solution for nickel plating, and the thickness of a plating layer is thickened to0.5 micrometer-1 micrometer, so that the nickel-plating thickness value of a copper plate is large, the nickel-plating purity is improved, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of copper plate surface treatment, in particular to a high-purity nickel plating method for copper plates. Background technique [0002] Copper is a transition element, chemical symbol Cu, English copper, atomic number 29. Pure copper is a soft metal, its surface is reddish orange with metallic luster when it is just cut, and its single substance is purplish red. Good ductility, high thermal conductivity and electrical conductivity, so it is the most commonly used material in cables and electrical and electronic components. It can also be used as a building material and can form many kinds of alloys. Copper alloys have excellent mechanical properties and low electrical resistivity, the most important of which are bronze and brass. In addition, copper is also a durable metal that can be recycled many times without loss of its mechanical properties. [0003] The method of plating a layer of nickel on metal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/14C25D5/34C25D3/12
CPCC25D3/12C25D5/14C25D5/34
Inventor 李开蒋光勇
Owner 广汉龙润科贸有限责任公司
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