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Quantum dot LED packaging structure and manufacturing method thereof

A technology of LED packaging and manufacturing methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to export heat from LED light sources in time, low color saturation, and insufficiently bright colors, so as to improve service life and high luminous efficiency. , the effect of good heat dissipation

Inactive Publication Date: 2020-07-03
广东良友科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, in liquid crystal displays, white LEDs are generally used as backlight sources, and the most common white LEDs are blue light-emitting chips with yellow YAG phosphor powder structure. The color saturation of the LCD screen using this LED is low, and the color is not bright enough. Its overall tightness is strong, so that the heat generated by the LED light source cannot be exported in time, which affects its service life

Method used

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  • Quantum dot LED packaging structure and manufacturing method thereof
  • Quantum dot LED packaging structure and manufacturing method thereof
  • Quantum dot LED packaging structure and manufacturing method thereof

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Embodiment 1

[0030] see Figure 1-Figure 3 As shown, one of the purposes of this embodiment is to provide a quantum dot LED packaging structure, including a substrate 100, the two ends of the substrate 100 are integrally formed with side baffles 101, the interior of the substrate 100 is provided with an LED chip 102, and the substrate 100 The top is provided with an inner barrier layer 200, the side of the inner barrier layer 200 close to the LED chip 102 is recessed inwardly with a groove 300, the inside of the groove 300 is provided with a quantum dot layer 301, and the gap between the quantum dot layer 301 and the LED chip 102 is covered with Silicone layer 106.

[0031] In this embodiment, the inner barrier layer 200 includes one or more of silicon dioxide, aluminum nitride, aluminum nitride silicon nitride compound, aluminum oxide, aluminum, silver, lead, and tin, all of which are low Water and oxygen permeability material.

[0032] Further, the side baffles 101 have a right-angled ...

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Abstract

The invention relates to the technical field of semiconductor lighting, in particular to a quantum dot LED packaging structure and a manufacturing method thereof. The structure comprises a substrate,wherein side baffles are integrally formed at the two ends of the substrate, an LED chip is arranged in the substrate, an inner blocking layer is arranged at the top of the substrate, a groove is formed in the side, close to the LED chip, of the inner blocking layer in an inwards concave mode, a quantum dot layer is arranged in the groove, and a silica gel layer covers the position between the quantum dot layer and the LED chip. The quantum dot light-emitting technology is adopted, the light-emitting peak of quantum dots is narrow, the light-emitting color is adjustable along with the size ofthe quantum dots, the light-emitting efficiency is high, meanwhile, the overall heat dissipation performance is good, heat accumulation can be avoided, and the overall service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to a quantum dot LED packaging structure and a manufacturing method thereof. Background technique [0002] Visible light can be radiated when electrons and holes recombine, so they can be used to make light-emitting diodes. It is used as an indicator light in circuits and instruments, or as a text or number display. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. At present, in liquid crystal displays, white LEDs are generally used as backlight sources, and the most common white LEDs are blue light-emitting chips and yellow YAG phosphor powder. The color saturation of the LCD screen using this LED is low, and the color is not bright enough. Its overall tightness is strong, so that the heat generated by the LED light source cannot be exported in ti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/64H01L33/48
CPCH01L33/486H01L33/505H01L33/507H01L33/642H01L2933/0033H01L2933/0041
Inventor 廖建文廖梓成
Owner 广东良友科技有限公司
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