COB camera module and packaging method thereof

A camera module and packaging method technology, which is applied to the assembly of printed circuits with electrical components, image communication, television, etc., can solve problems such as optical axis deviation, achieve the effects of improving yield rate, improving fault tolerance, and eliminating assembly errors

Active Publication Date: 2020-07-03
横店集团东磁有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the shortcomings of the above-mentioned optical axis correction method, the present invention provides a COB camera module packaging method, which solves the problem of optical axis deviation that occurs with the stacking of components in the prior art, and adopts modular camera module packaging method,

Method used

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  • COB camera module and packaging method thereof
  • COB camera module and packaging method thereof
  • COB camera module and packaging method thereof

Examples

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Example Embodiment

[0036] Example

[0037] Such as figure 1 As shown, a method for packaging a COB camera module includes the following steps:

[0038] S1. Cleaning and drying the circuit board 1, the chip 2 and the filter assembly 3;

[0039] S2. Attach the chip 2 to the circuit board 1 and perform pressure welding, and clean and dry after the wire bonding;

[0040] S3. Attach the filter assembly 3 to the chip 2 and dry it to obtain a module 4;

[0041] S4. Clean and dry the lens 51 and the motor 52 respectively;

[0042] S5. The lens 51 is locked in the motor 52 by the locking machine to obtain the module two 5. The lens 51 is higher than the motor 52 by the specific height h1 corresponding to the best focal length;

[0043] S6. Temporarily fix the position of module 2 5 and adjust its internal lens 51 to the highest position, use the camera active focusing device to detect the coincidence of the optical axis of module 1 with the optical axis of module 2 5, and adjust it to the maximum within the accuracy...

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Abstract

The invention discloses a COB camera module and a packaging method thereof. The voice coil motor comprises a circuit board, a chip attached to the circuit board, a light filtering assembly attached tothe chip, a motor and a lens locked inside the motor, the motor is glued to the light filtering assembly, the locking height of the lens on the motor is h1, and the distance between the voice coil motor and the light filtering assembly is h2. The camera module is packaged by adopting two specific sizes of h1 and h2, and is matched with compensation type optical axis correction, so that the automatic focusing accuracy of the camera module and the optical axis overlap ratio between modules can be improved to the greatest extent. The automatic focusing accuracy of the COB camera module is improved by adopting two specific sizes of h1 and h2; defective products are accurately discriminated through compensation type optical axis correction, and meanwhile, the fault tolerance of optical axis correction is improved, so that the yield is improved; grading of the COB camera module can be completed in the packaging process through primary optical axis correction and compensation type secondarycorrection of the camera active focusing equipment.

Description

technical field [0001] The invention relates to the technical field of camera manufacturing, in particular to a COB camera module and a packaging method thereof. Background technique [0002] There are two packaging modes for traditional camera modules: COB (Chip On Board) and CSP (Chip Scale Package). The advantage of CSP packaging is that the packaging section is completed by the front-end process, and the chips in CSP packaging have lower requirements for cleanliness, better yield rate, low cost of process equipment, and short process time because of the glass covering. Poor transmittance, more expensive, higher height, backlight penetration ghost phenomenon. COB packaging has the advantages of better image quality, lower packaging cost, and lower module height. In addition, major brand manufacturers gradually require module manufacturers to assemble and ship products using the COB process. In the future, the COB process will become the mobile phone camera module A tren...

Claims

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Application Information

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IPC IPC(8): H04N5/225H05K3/34
CPCH05K3/34H04N23/52H04N23/50H04N23/55H04N23/51H04N23/54
Inventor 骆淑君赵喜许烨焓张奕贾康康
Owner 横店集团东磁有限公司
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