Rotary washing and drying device

Abstract

The invention belongs to the field of washing and drying equipment, and particularly discloses a rotary washing and drying device. The rotary washing and drying device comprises a machine base, a washing frame, a liquid tank, a supporting shell and a washing mechanism, the supporting shell and the washing frame are fixedly installed on the end face of the machine base, the washing mechanism is installed on the inner side of the washing frame, and the liquid tank is fixedly installed on the top of the washing frame. The supporting shell is arranged on the inner side of the cleaning frame, fixing bases are connected to the two sides of the supporting shell, and a fixing frame is installed at the top of the supporting shell; the cleaning mechanism comprises a driving assembly, a cleaning brush, a box body and a flushing frame, the box body is fixedly installed on the two sides of the top of the cleaning frame, and a rotating disc is arranged in the box body; and the driving assembly is provided with a motor, a rotating rod and a transmission rod, the motor is fixedly installed at the top end of the supporting shell, and the motor output end is connected with the rotating rod. The wafer is cleaned and then dried, so that the wafer enters and exits in a dry mode, the wafer is prevented from being polluted by the external environment in the technological process, the space occupied by equipment is saved, and a better cleaning effect is achieved through washing and brushing.

Description

technical field [0001] The invention relates to the field of washing and drying equipment, in particular to a rotary washing and drying device. Background technique [0002] Wafer refers to the substrate (also called substrate) for manufacturing semiconductor transistors or integrated circuits. Because it is a crystalline material, its shape is round, so it is called a wafer. Substrate materials include silicon, germanium, etc. Since silicon is the most commonly used, if the crystalline material is not specified, it usually refers to silicon wafers. Various circuit element structures can be processed on silicon wafers, and become integrated circuit products with specific electrical functions. [0003] In the manufacturing process of semiconductor integrated circuits, cleaning and drying of wafers are essential process requirements in the production of semiconductor devices. Wafer cleaning is mainly used to remove particles such as organic matter, inorganic matter and met...

AI Technical Summary

Problems solved by technology

This method bears great disadvantages: the cleaning and drying process is carried out in separate chambers, so that the wet wafers after cleaning are exposed to the risk of contamination by the external environment during the transfer process, moreover, the cleaning and drying processes are separated If it is carried out, at least two process chambers are necessary, which will inevitably increase the floor space of the equipment and also cause an increase in the overall cost of the equipment.

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