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Hot stamping plate manufacturing method

A production method and hot stamping plate technology, applied in the field of hot stamping printing, can solve the problems of poor self-lubrication and anti-adhesion impurities of copper materials, affecting the cost and profit of enterprises, and consuming a lot of time.

Inactive Publication Date: 2020-07-10
CHONGQING HONGSHENG PRINTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The hot stamping plates used in hot stamping production in the modern printing industry are mainly copper hot stamping plates. In the production process of copper hot stamping plates, in order to keep the hot stamping flat, the surface of the hot stamping plates is generally polished, and the surface roughness Ra is basically Keep within the value of 0.8, but the self-lubrication and anti-adhesion impurities of copper materials are poor. Therefore, in the actual hot stamping process, the graphic surface of the copper hot stamping plate is easily adhered to after high temperature and high pressure. Electrochemical aluminum powder, paper scraps, dust and other impurities are not easy to fall off, causing some defects, unsaturation, pits and other hot stamping waste products on the pattern on the hot stamping product (that is, the term in the industry: the quality problem of anti-sticking), At this time, it is necessary to stop the machine and use a copper wire brush to clean and polish the surface of the copper hot stamping plate several times for manual treatment. However, during the cleaning and polishing process, the paper in the hot stamping machine is easily baked by the residual heat of the hot stamping plate Deformation occurs, and the layout size will also expand after being heated. If the expansion is serious, it can reach an error of 40-50 silk, causing the hot stamping paper to become a waste product. Moreover, due to the change of the layout size, the operator often needs to check the position of the hot stamping plate. Adjustment requires a lot of time and a lot of energy for the operator, plus the waste products that have been reversed and repeated hot stamping before, so every time the hot stamping plate has reversed sticking quality problems, it will lead to a lot of waste of material costs and time costs, and This problem has not been completely and effectively solved, resulting in many problems such as low production efficiency and quality pass rate of hot stamping process, high production cost, etc., which seriously affects the cost and profit of the enterprise. It is a common feature that exists in the company and printing industry and needs to be solved urgently question
[0003] Therefore, how to develop a new type of surface wear-resistant and non-sticky hot stamping plate is a difficult point that must be overcome in the hot stamping production process of the current printing industry. The purpose is to solve the long-standing hot stamping plate in the hot stamping process. Common technical problems such as paper scraps, impurities, aluminum powder, etc., so as to reduce the scrap rate in the production process of printing enterprises, improve production efficiency, and provide guarantee for enterprises to better improve product quality and production costs

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Embodiment Construction

[0037] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, the following describes the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings For further detailed explanation.

[0038] In the description of the present invention, unless otherwise specified and limited, it should be noted that the term "connection" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be Directly connected or indirectly connected through an intermediary, those skilled in the art can understand the specific meanings of the above terms according to specific situations.

[0039] Such as figure 1 As ...

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Abstract

The invention discloses a hot stamping plate manufacturing method. A hot stamping plate is manufactured by using a copper base plate. The hot stamping plate manufacturing method comprises the following steps of carrying out corrosion treatment on the copper base plate by using a corrosion liquid first and forming a relief block pattern; then carrying out spraying pretreatment on the plate surfaceof the copper base plate; then spraying the plate surface of the copper base plate and curing a primer coating, wherein the primer coating is Teflon 850 314 and carrying out activation by using a promoter VM-7799 in a fit manner, spraying and sintering a finishing coating to the primer coating, wherein the finishing coating is Teflon 851 214; and finally, treating the surface of the coating, wherein the coating is glossy. The hot stamping plate surface has the characteristics of being non-adhesive, high-temperature-resistant and wear-resistant, and solves the common technical problems that thehot stamping plate in an existing hot stamping process production process is easy to be adhesive to scraps of paper, impurities, aluminum powder and the like.

Description

technical field [0001] The invention relates to the field of hot stamping printing, in particular to a method for making a hot stamping plate. Background technique [0002] The hot stamping plates used in hot stamping production in the modern printing industry are mainly copper hot stamping plates. In the production process of copper hot stamping plates, in order to keep the hot stamping flat, the surface of the hot stamping plates is generally polished, and the surface roughness Ra is basically Keep within the value of 0.8, but the self-lubrication and anti-adhesion impurities of copper materials are poor. Therefore, in the actual hot stamping process, the graphic surface of the copper hot stamping plate is easily adhered to after high temperature and high pressure. Electrochemical aluminum powder, paper scraps, dust and other impurities are not easy to fall off, causing some defects, unsaturation, pits and other hot stamping waste products on the pattern on the hot stampin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/00C23F1/02C23F1/14
CPCB41C1/00C23F1/02C23F1/14
Inventor 郎小林毛波骆志伟
Owner CHONGQING HONGSHENG PRINTING