A kind of copper foil additive for the fifth generation mobile communication board, copper foil and its production process

A mobile communication and additive technology, applied in electroforming, electrolysis process, etc., can solve the problems of unsatisfactory bonding force and signal loss, unsuitable copper foil, low roughness, etc., to improve the uniformity of microstructure and signal loss. less, the effect of reducing the roughness

Active Publication Date: 2020-10-16
东强(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electrolytic copper foil produced by this invention has high precision, fineness and compactness, smoothness, brightness, low roughness, and ultra-thin, which meets the actual operation requirements, but the copper foil prepared in this invention is not suitable for the fifth generation mobile communication (5G) Frequency and high-speed boards, the bonding force and signal loss after lamination of copper foil and 5G boards do not meet the requirements

Method used

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  • A kind of copper foil additive for the fifth generation mobile communication board, copper foil and its production process
  • A kind of copper foil additive for the fifth generation mobile communication board, copper foil and its production process
  • A kind of copper foil additive for the fifth generation mobile communication board, copper foil and its production process

Examples

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Comparison scheme
Effect test

Embodiment 1

[0058] An electrolytic copper foil additive for the fifth-generation mobile communication high-frequency and high-speed board, the additives are additive A and additive B;

[0059] Additive A includes the following components: 0.1 g / L of cerium sulfate and 1 g / L of sodium mercaptoimidazole propanesulfonate.

[0060] Additive B includes the following components: sodium phenyl dithiopropane sulfonate (BSP) 15 mg / L and thiazolinyl sodium dithiopropane sulfonate (SH110) 5 mg / L.

[0061] The preparation method of 12 μm copper foil comprises the steps:

[0062] (1) Preparation of electrolyte: adding copper to a solution containing sulfuric acid to obtain an electrolyte, the content of copper in the electrolyte is 60g / L, the content of sulfuric acid is 100g / L, and the temperature is 50°C;

[0063] (2) Preparation of raw foil: add additive A to the electrolyte prepared in step (1), and conduct electrodeposition on the cathode roll. During the electrodeposition process, the flow rate ...

Embodiment 2

[0069] An electrolytic copper foil additive for the fifth-generation mobile communication high-frequency and high-speed board, the additives are additive A and additive B;

[0070] Additive A includes the following components: lanthanum sulfate 0.2g / L and hexylbenzylamine salt 2g / L.

[0071] Additive B includes the following components: sodium phenyldithiopropanesulfonate (BSP) 20mg / L and sodium thiazolinyldithiopropanesulfonate (SH110) 7mg / L.

[0072] The preparation method of 18 μm copper foil comprises the steps:

[0073] (1) Preparation of electrolyte: adding copper to a solution containing sulfuric acid to obtain an electrolyte, the content of copper in the electrolyte is 65g / L, the content of sulfuric acid is 120g / L, and the temperature is 52°C;

[0074] (2) Preparation of raw foil: add additive A to the electrolyte prepared in step (1), and conduct electrodeposition on the cathode roller. The flow rate of the electrolyte during the electrodeposition process is 45m 3 / ...

Embodiment 3

[0079] An electrolytic copper foil additive for the fifth-generation mobile communication high-frequency and high-speed board, the additives are additive A and additive B;

[0080] Additive A includes the following components: 0.1 g / L of cerium sulfate, 0.1 g / L of lanthanum sulfate, 1 g / L of sodium mercaptoimidazole propanesulfonate and 1 g / L of hexylbenzylamine salt.

[0081] Additive B includes the following components: sodium phenyl dithiopropane sulfonate (BSP) 30 mg / L and thiazolinyl sodium dithiopropane sulfonate (SH110) 10 mg / L.

[0082] The preparation method of 35 μm copper foil comprises the steps:

[0083] (1) Preparation of electrolyte: adding copper to a solution containing sulfuric acid to obtain an electrolyte, the content of copper in the electrolyte is 70g / L, the content of sulfuric acid is 140g / L, and the temperature is 52°C;

[0084] (2) Preparation of raw foil: add additive A to the electrolyte prepared in step (1), and conduct electrodeposition on the cat...

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Abstract

The invention provides a copper foil additive for a fifth-generation mobile communication board, copper foil and a production process thereof, and belongs to the technical field of electrolytic copper foil production. In the present invention, additive A is added to the electrolytic solution before copper foil electrodeposition, so that the prepared electrolytic copper foil has ultra-low roughness. Make a uniform and fine-grained layer on the microscopic surface of the copper foil, increase the microscopic specific surface area of ​​the copper foil, enhance the anti-oxidation ability, and increase the bonding force between the copper foil and the 5G high-frequency high-speed board after lamination, so that the final product can be obtained The roughness of the electrolytic copper foil Rz≤1.5μm, the bonding force of 12μm copper foil≥0.3kgf / cm, the bonding force of 18μm copper foil≥0.4kgf / cm, the bonding force of 35μm copper foil≥0.5kgf / cm, suitable for 5G Manufacture of high-frequency high-speed boards.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil production, and specifically relates to an electrolytic copper foil additive, an electrolytic copper foil and a production process of the electrolytic copper foil suitable for fifth-generation mobile communication high-frequency and high-speed boards. Background technique [0002] In recent years, with the development trend of the electronics industry, including the Internet of Things, Internet of Vehicles, cloud computing / servers, and smart phones, human life has entered an era of "everywhere" communication. As a key material for power and signal transmission, printed circuit boards are the focus of research in the "high-speed era". Copper-clad laminate is the basic material of printed circuit boards, and copper foil, resin, and glass fiber cloth are the three major raw materials of copper-clad laminates, and their quality directly affects PCB signal transmission. [0003] As on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 林家宝
Owner 东强(连州)铜箔有限公司
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