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Conductive Adhesive Composition

A conductivity and adhesive technology, applied in the direction of conductive adhesives, adhesives, non-polymer adhesive additives, etc., to achieve excellent conductivity

Active Publication Date: 2021-08-10
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, as mentioned above, in order to obtain isotropic conductivity, it is necessary to mix a high degree of conductive filler, and there is still room for further improvement in terms of both bonding and isotropic conductivity

Method used

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  • Conductive Adhesive Composition
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Examples

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Embodiment

[0058] The following are examples of the present invention, but the present invention is not limited by the following examples. In addition, unless otherwise specified, the following compounding ratio etc. are based on mass.

[0059] According to the compounding shown in the following Table 1, each component was mixed and the conductive adhesive composition was prepared. This was applied to a release-treated polyethylene terephthalate (PET) film (release film 18 ) to produce a conductive bonding film with a film thickness of 60 μm. The details of the compounds described in the table are as follows, where Tm represents the melting point, Tg represents the glass transition temperature, and Mn represents the number average molecular weight.

[0060] ・Crystalline thermoplastic resin 1: crystalline polyester, Tm=120°C, Mn=22000

[0061] ・Crystalline thermoplastic resin 2: Crystalline polyester, Tm=95°C, Mn=20000

[0062] ・Amorphous thermoplastic resin: Amorphous polyester, Tg=65...

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Abstract

To provide a conductive adhesive composition that can be processed below 120°C and has both isotropic conductivity and excellent bonding properties. The conductive adhesive composition contains a resin component containing at least (A) a crystalline thermoplastic resin having a melting point of 100° C. or higher, (B) an amorphous thermoplastic resin, and (C) a dendrite-shaped conductive filler. ) a carboxyl-modified polyester resin, wherein the dendrite-shaped conductive filler is 50 to 300 parts by mass relative to 100 parts by mass of the resin component.

Description

technical field [0001] The present invention relates to conductive adhesive compositions. Background technique [0002] As a method of electrically connecting an electronic component and a substrate, use of a conductive adhesive composition in which a conductive filler is dispersed can be mentioned. As the above conductive adhesive composition, for example, Patent Document 1 aims to provide a thermoplastic resin composition having excellent mechanical strength and heat resistance, and also excellent electrical properties such as conductivity and antistatic property, and describes Thermoplastic resin composition composed of thermoplastic resin (component A), crystalline thermoplastic resin (component B), conductive carbon black (component C), and conductive carbon black or hollow carbon fiber whose specific surface area is larger than that of component C conductive carbon black . [0003] However, depending on the application, a conductive adhesive composition capable of ob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00C09J9/02C09J11/04C09J167/00H01B1/22
CPCC09J167/00C09J201/00C09J9/02C09J11/04H01B1/22C08L67/00C08L101/00
Inventor 高桥章郎
Owner TATSUTA ELECTRICWIRE & CABLE
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