Device for measuring microscopic contact state of polishing pad and using method thereof

Abstract

The invention discloses a measuring device for the microscopic contact state of a polishing pad and a method for using the same. The measuring device includes a base, a Z-direction macro-micro composite linear motion feeding device, a force sensor, a sapphire observation window, two monoculars Microscope, two CCD cameras, two microscope stands, XY two-way moving table, motion control system and computer. The invention uses an optical microscope to directly photograph the contact interface of the polishing pad to obtain a real microscopic contact image, and the result is more accurate and reliable. When the polishing pad sample is fixed, the present invention can ensure the uniform bonding between the surface to be tested and the surface of the sapphire glass, and avoids the phenomenon of uneven contact. The invention utilizes the DIC method to directly obtain the displacement nephogram of the polishing pad during the compression process, and accurately obtain the compression stiffness of the rough layer on the surface of the polishing pad, thereby providing reliable data support for the analysis of the microscopic contact state of the polishing pad.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a measuring device for the microscopic contact state of a polishing pad and an application method thereof. [0002] technical background [0003] Chemical Mechanical Polishing (CMP) technology, as an ultra-precision processing method, has been widely used in semiconductor preparation, optical parts processing and other fields. Typical chemical mechanical polishing process equipment such as figure 1 shown. During the polishing process, the workpiece 1 is held by the polishing head 2 and rotates around the axis while reciprocating. Under a given polishing load, the polishing head 2 presses the workpiece 1 against the surface of the rotating polishing pad 3 . The trimmer 4 will constantly trim and update the surface state of the polishing pad. During the movement, the polishing liquid 5 containing polishing abrasive grains is continuously brought into the co...

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Problems solved by technology

However, the authors also used a pneumatic device to control the loading process, therefore, the uniform contact during the contact process cannot be guaranteed

Moreover, the author used two independent test devices to carry out experiments respectively, and the obtained microscopic contact images and the compressive stiffness of the surface roughness layer cannot achieve a one-to-one correspondence

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