A special etching equipment for quartz wafer production and its application method

Abstract

The invention relates to the field of quartz wafer production equipment, in particular to a special etching equipment for quartz wafer production and a method for using the same, including a stand on which a drive mechanism and a conveyor belt are arranged, the drive mechanism is located above the conveyor belt, and the drive mechanism There are connecting rod assemblies on both sides, the connecting rod assembly on the right is connected to the etching solution output mechanism, the connecting rod assembly on the left is connected to the cleaning liquid output mechanism, the cleaning liquid output mechanism is connected to the waste liquid recovery mechanism, and the conveyor belt passes through the chain The wheel assembly is connected with the driving mechanism, and multiple solution pools are fixed at equal intervals on the conveyor belt. This kind of special etching equipment for quartz wafer production and its use method drive the conveyor belt to transport the quartz wafer at a constant speed through the driving mechanism, so that the etching time is easy to control, and the etching solution is automatically injected, and the output of the etching solution is uniform and controllable. The waste liquid is recovered while cleaning the etched quartz wafer, thereby improving the cleaning effect and the efficiency of recovering the waste liquid.

Description

technical field [0001] The invention relates to the field of quartz wafer production equipment, in particular to a special etching equipment for quartz wafer production and a method for using the same. Background technique [0002] When the quartz wafer is subjected to the wet etching process, the quartz wafer is first placed in the etching solution, and then after a period of time, the quartz wafer is placed in the cleaning solution for cleaning. The labor intensity of the staff is increased during the transfer process. On the other hand, the contact time between the etching solution and the quartz wafer is difficult to control, so it is often difficult to control the etching depth. After the etching is completed, the quartz wafer is cleaned with a cleaning solution. When it is difficult to recycle the mixed waste liquid, it is difficult to recycle the cleaning solution and etching solution. In view of this, we propose a special etching equipment for quartz wafer production...

AI Technical Summary

Problems solved by technology

[0002] When the quartz wafer is subjected to the wet etching process, the quartz wafer is first placed in the etching solution, and then after a period of time, the quartz wafer is placed in the cleaning solution for cleaning. The labor intensity of the staff is increased during the transfer process. On the other hand, the contact time between the etching solution and the quartz wafer is difficult to control, so it is often difficult to control the etching depth. After the etching is completed, the quartz wafer is cleaned with a cleaning solution. When the mixed waste liquid is difficult to recycle, it is difficult to recycle the cleaning solution and etching solution. In view of this, we propose a special etching equipment for quartz wafer production and its use method

Images