Polyamide 6 composition and preparation method thereof

Abstract

The invention relates to a polyamide 6 composition and a preparation method thereof. The polyamide 6 composition is prepared from the following raw materials: polyamide 6-A resin, polyamide 6-B resin,ethylene-octene copolymer grafted maleic anhydride, hollow glass beads, polyhedral oligomeric silsesquioxane polymer, titanate coupling agent, polytetrafluoroethylene resin, hyperbranched polyester polymer, erucyl amide, N, N '-bis (2, 2, 6, 6-tetramethyl-4-piperidyl)-1, 3-benzenedicarboxamide and bis (2, 6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate. The polyamide 6 composition hasexcellent mechanical properties, processability and low dielectric constant, and can be applied to shells, cladding and protective materials and the like of 5G base stations, micro base station systems, data communication terminals, antennas and radio frequency modules.

Description

technical field [0001] The invention relates to the field of materials, in particular to a polyamide 6 composition and a preparation method thereof. Background technique [0002] Dielectric materials, also known as dielectrics, are electrical insulating materials. According to performance, there are high dielectric materials and low dielectric materials. For low dielectric materials, with the rapid development of electronic information technology, electronic products are developing in the direction of lightweight, high performance and multifunctionality, and it is increasingly necessary to develop low dielectric constant ( D. k <3) Materials. At the same time, with the advent of the 5G era, the requirements for the transmission speed and loss of electronic signals are higher than those of 4G products. Usually, 4G products only require the dielectric constant of resin materials to be less than 3.7 (1GHz), while 5G products require The dielectric constant of the resin m...

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Problems solved by technology

However, polyamide has low notched impact strength, strong hygroscopicity, poor dimensional stability and high dielectric constant, so it is necessary to toughen and strengthen PA, and reduce the dielectric constant of PA composition by blending other lower dielectric constant materials. Electrical constant to meet the increasing demands in fields such as electronics, integrated circuit packaging and electromagnetic wave shielding

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