Preparation method of epoxy resin for copper coating of aluminum plate

Abstract

The invention provides a preparation method of epoxy resin for copper coating of an aluminum plate. The preparation method comprises the following steps: S1, adding a proper amount of deionized waterinto melamine, stirring until melamine is completely dissolved in deionized water, adding phytic acid, and stirring at 90 DEG C for 1-3 hours to obtain finishing liquid, wherein the mass ratio of melamine to phytic acid is 1: (0.5-1.5); S2, weighing bisphenol A epoxy resin, dissolving bisphenol A in anhydrous ethanol, after bisphenol A epoxy resin is completely dissolved, heating the solution to 60-90 DEG C, dropwise adding the finishing liquid into the mixed solution of bisphenol A epoxy resin and anhydrous ethanol, and carrying out a reaction under stirring at a constant temperature for 2-4hours to obtain modified epoxy resin, wherein the mass ratio of the finishing liquid to bisphenol A epoxy resin is (30-90): 100, and the softening point of bisphenol A epoxy resin is lower than 35 DEGC. N and P flame-retardant elements are introduced into bisphenol A epoxy resin; grafting of a flame retardant on epoxy resin is realized, the problem of dispersion of a flame retardant in epoxy resin is solved, the bonding performance of the modified epoxy resin is guaranteed, and meanwhile the thermal stability and the flame retardant performance of the modified epoxy resin are improved throughthe synergistic effect of N / P flame retardant elements and a stable net-shaped structure.

Description

technical field [0001] The invention relates to the technical field of aluminum substrates, in particular to a preparation method of epoxy resin used for copper cladding of aluminum substrates. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multilayer boards, which can be made by laminating ordinary multilayer boards with insulating layers and aluminum substrates. The insulating layer of the aluminum substrate is generally required to have a certain flame retardant effect. Commonly used epoxy resin flame retardant methods mainly include additiv...

AI Technical Summary

Problems solved by technology

Although the above reactive flame retardant epoxy resins have good flame retardant effects, their adhesive properties are insufficient and cannot be used in the aluminum plate copper clad process, and the compounds with cyclotriphosphazene structure are highly corrosive, and there are potential safety hazards in use.