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Detection method and detection equipment for infrared thermopile chip

A detection method, chip detection technology, applied in the direction of electric radiation detector, electronic circuit test, radiation pyrometry, etc., can solve the problem that the infrared response performance of the chip cannot be determined, whether it is qualified, etc., to reduce packaging costs and improve packaging efficiency Effect

Inactive Publication Date: 2020-08-21
JIANGSU HINOVAIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved in the present invention is to overcome the defect that the existing infrared thermopile chip electrical performance test method cannot determine whether the infrared response performance of the chip is qualified, thereby providing a detection method and detection equipment for an infrared thermopile chip

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  • Detection method and detection equipment for infrared thermopile chip
  • Detection method and detection equipment for infrared thermopile chip

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Experimental program
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Embodiment 1

[0034] like Figure 1-Figure 2 As shown, the present embodiment provides a detection method for an infrared thermopile chip, comprising the following steps:

[0035] S11, connecting the infrared thermopile chip with the source meter;

[0036] In this embodiment, the source meter itself can test the voltage, current and resistance, and it can be a Keithley source meter commonly used in the prior art;

[0037] As a specific embodiment, the probe of the probe station is connected to the test electrode of the infrared thermopile chip, and the wire of the probe station is connected to the source meter, so that the test electrode of the infrared thermopile chip is connected to the source meter;

[0038] As a variation, other ways can also be used to connect the wires to the source meter, such as directly welding the wires on the probe station, as long as the electrical connection between the probe station and the source meter can be completed.

[0039] S12, applying infrared radia...

Embodiment 2

[0049] This embodiment provides an infrared thermopile chip detection device, which can be used in the detection method for an infrared thermopile chip provided in Embodiment 1. The infrared thermopile chip detection device includes a probe station 4, a source meter 3 and a micro-infrared light source 2 .

[0050] The probe station 4 comprises a sample station, two probes and two wires communicated with the probes respectively, wherein the sample station is used to place thermopile wafers with a number of infrared thermopile chips 11 to be measured, and the probes are used to communicate with the infrared thermopile The test electrode 115 of chip is connected, and lead is used for being connected with source table 3; Wherein, as figure 2 As shown, the infrared thermopile chip 11 includes a substrate 111 and a support layer 112 stacked on its surface. The surface of the support layer facing away from the substrate is provided with a first installation area and a second install...

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Abstract

The invention provides a detection method and detection equipment for an infrared thermopile chip. The method comprises the steps of: applying infrared radiation to an infrared absorption region of the infrared thermopile chip, enabling the infrared absorption region to absorb the infrared radiation and transmit the heat to a thermopile thermocouple, enabling the thermocouple to generate a voltage, and acquiring an actual output voltage value of the chip through a source meter; and comparing the difference between the actual output voltage value of the chip and a designed output voltage valuewith a design threshold, and if the difference is smaller than or equal to the design threshold, judging that the infrared thermopile chip is qualified. According to the detection method, whether thermopile thermocouples are conducted with each other and whether the infrared response performance of the infrared absorption region is qualified can be judged at the same time, so that the detection efficiency and accuracy of the infrared thermopile chip are effectively improved, and a new method for detecting the infrared thermopile chip is provided.

Description

technical field [0001] The invention relates to the field of infrared thermopile sensors, in particular to a detection method and detection equipment for an infrared thermopile chip. Background technique [0002] Micromachined infrared thermopile products are often used in the field of non-contact infrared temperature measurement due to their relatively high responsivity, short response time, no need for bias voltage, and low production costs. Its preparation method usually adopts a MEMS process route compatible with CMOS to prepare tens of thousands of chips on a wafer through semiconductor chip process. The general process is at the micro-nano level. Due to process fluctuations and other factors during the preparation process, the chips will have performance differences, or even defective or defective products. Therefore, after the preparation process is completed, an electrical performance test is performed on it to eliminate unqualified chips in the package. [0003] A...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/067G01J5/12
CPCG01J5/12G01J2005/123G01R1/067G01R31/2856G01R31/2875G01R31/2887
Inventor 丁雪峰毛海央张琛琛
Owner JIANGSU HINOVAIC TECH CO LTD