Manufacturing method of metal microcolumn array with superhigh depth-to-width ratio

Abstract

The invention discloses a manufacturing method of a metal microcolumn array with a superhigh depth-to-width ratio and belongs to the technical field of micro-manufacturing. Based on the UV-LIG technology, on a stainless steel substrate, a traditional manufacturing technology of a microcolumn with a high depth-to-width ratio is converted into the manufacturing technology of a micro-structure with the high width-to-depth ratio, so that developing and microelectroforming of a micro blind hole structure with a superhigh depth-to-width ratio are converted into developing and microelectroforming ofa micro groove; in the manufacturing process, the mass transferring difficulty caused by high depth-to-width ratio is avoided; the lamination photoresist technology is utilized, through multiple SU-8photoresist alignment, nickle microelectroforming, copper conducting layer sputtering and planarization treatment after casting, the microcolumn array and a bottom plate are obtained through manufacturing; and the internal stress of a casting coating is reduced and the binding force between the coatings is improved through utilizing the vacuum annealing technology. With adoption of the manufacturing method, the manufacturing problem of the metal microcolumn array with the depth-to-width ratio being greater than or far greater than 10:1 is solved, and the larger the depth-to-width ratio of themicrocolumn is, the more remarkable the benefits of the manufacturing method are. In addition, the manufacturing method has the advantages that the binding force of the microcolumn and a back plate ishigh and the binding force between the casting coatings is high.

Description

technical field [0001] The invention belongs to the field of micro-manufacturing, and relates to micro-electroforming metal array devices, in particular to a method for preparing ultra-high aspect ratio metal micro-column arrays based on a UV-LIGA process. Background technique [0002] Ultra-high aspect ratio metal microcolumn arrays have good electrochemical characteristics as array electrodes, which can significantly improve the performance of metal microdevices such as frequency range, sensitivity, and reliability, and because of their large specific surface area, they can be greatly improved. improve cooling efficiency. Therefore, ultra-high aspect ratio metal micropillar arrays are increasingly used in aerospace, energy, optics, communications, biomedicine, etc., and their processing and preparation methods have attracted the attention of researchers. The existing processing methods of high aspect ratio metal microcolumn array devices mainly include micro electric disc...

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