A method for fabricating an ultra-high aspect ratio metal microcolumn array
A technology of micro-column array and manufacturing method, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of production failure, adhesive film detached from the substrate, easy to damage the adhesive film structure, etc., and achieve the binding force Strong, strong casting layer binding force, avoiding the effect of difficult mass transfer
Active Publication Date: 2022-03-29
DALIAN UNIV OF TECH
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Problems solved by technology
This method solves the "lost casting" problem of high aspect ratio microstructures to a certain extent, but the aspect ratio of the fabricated microcolumn structure is limited, and the adhesive film structure is easily destroyed by ultrasonic development and ultrasonic electroforming, making the adhesive film detached from the substrate. resulting in failure to produce
[0006] At present, there are still technical bottlenecks in the method of using UV-LIGA technology to fabricate high-aspect-ratio metal micropillar arrays, especially in the research on the fabrication process of ultra-high aspect ratio metal micropillar arrays with an aspect ratio greater than or much greater than 10:1. On the one hand, this technical bottleneck needs to be broken through
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[0060] The present invention takes the manufacture of a 4×6 nickel micro-square column array with an aspect ratio of 30:1, a micro-column side length of 10 μm, and a height of 300 μm as an example. The specific implementation of the present invention will be described in detail below in conjunction with the above technical scheme and accompanying drawings. Way.
[0061] For example: 4 × 6 arrays of nickel metal micropillars are fabricated on the ground and polished stainless steel substrate N, and the size of the stainless steel substrate is 60 × 60 × 3mm 3 , the size of a single microcolumn is 10×10×300 μm 3 , the column spacing is 10μm and 20μm, and the thickness of the backplane is 400×400×300μm 3 , with a structure such as figure 1 As shown, 1 is the bottom plate, and 2 is the nickel microcolumn. The nickel metal microarray is divided into nine layers of material fabrication, specifically including the fabrication of marking points on the back, the fabrication of nine l...
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Abstract
The invention discloses a method for manufacturing an ultrahigh aspect ratio metal microcolumn array, which belongs to the field of micromanufacturing technology. Based on UV-LIGA technology, on the stainless steel substrate, the traditional high-aspect-ratio micro-column manufacturing process is converted into a high-aspect-ratio micro-structure manufacturing process, so that the development of "ultra-high aspect ratio micro-blind hole structure and microelectronics Casting" is transformed into "micro-groove development and micro-electroforming", which avoids the difficulty of mass transfer caused by high aspect ratio during the production process; using the stacked photoresist process, through multiple SU-8 photoresist overlays , micro-electroforming nickel, sputtering copper conductive layer and post-casting planarization treatment, the micro-column array and the base plate are produced; the internal stress of the casting layer is reduced by vacuum annealing process, and the bonding force between the casting layers is improved. The present invention solves the difficult problem of manufacturing ultra-high aspect ratio metal microcolumn arrays with an aspect ratio greater than or much greater than 10:1, and the greater the microcolumn aspect ratio, the more obvious the beneficial effect of the present invention. In addition, the invention has the advantages of strong bonding force between the microcolumn and the back plate, strong bonding force between casting layers, and the like.
Description
technical field [0001] The invention belongs to the field of micro-manufacturing, and relates to micro-electroforming metal array devices, in particular to a method for preparing ultra-high aspect ratio metal micro-column arrays based on a UV-LIGA process. Background technique [0002] Ultra-high aspect ratio metal microcolumn arrays have good electrochemical characteristics as array electrodes, which can significantly improve the performance of metal microdevices such as frequency range, sensitivity, and reliability, and because of their large specific surface area, they can be greatly improved. improve cooling efficiency. Therefore, ultra-high aspect ratio metal micropillar arrays are increasingly used in aerospace, energy, optics, communications, biomedicine, etc., and their processing and preparation methods have attracted the attention of researchers. The existing processing methods of high aspect ratio metal microcolumn array devices mainly include micro electric disc...
Claims
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IPC IPC(8): C25D1/00C25D1/10C23C14/35C23C14/16B33Y10/00
CPCC25D1/003C25D1/10C23C14/35C23C14/165B33Y10/00
Inventor杜立群曹强杜成权肖海涛赵明翟科
OwnerDALIAN UNIV OF TECH