White photosensitive film, and preparation method and application thereof

A photosensitive film, white technology, applied in the direction of optomechanical equipment, photosensitive materials for optomechanical equipment, optics, etc.

Pending Publication Date: 2020-09-11
SHANGHAI FUSAITE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the photosensitive cover film is coated with this formula, there will be a problem of shelf life. The pre-baking condition of the ink is about 70 degrees, and the time is generally about 30 minutes. The time is generally a few minutes, so the baking temperature generally exceeds 100 degrees. Such high temperature conditions are more likely to promote the hinge reaction. In addition, the coated photosensitive cover film generally needs to have a shelf life of at least 3 months.

Method used

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  • White photosensitive film, and preparation method and application thereof
  • White photosensitive film, and preparation method and application thereof
  • White photosensitive film, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0080] Synthesis example 1: Synthesis of epoxy resin-(meth)acrylic resin

[0081] In a four-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 207.1 grams of epoxy resin (YDCN-704, the epoxy equivalent is 207.1) (Japan Tohto Chemical), diethylene glycol 186 grams of ether acetate, 73 grams of acrylic acid, 0.8 grams of triphenylphosphine, 0.03 grams of 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl radical, after stirring into a homogeneous solution , gradually heated to 120°C, after 12 hours, 66 grams of tetrahydrophthalic anhydride was added to the reactor, then the reaction temperature was adjusted to 100°C, after stirring for 5 hours, the acid-modified epoxy- Acrylic resin, known as alkali-soluble resin 1.

Synthetic example 2

[0082] Synthesis Example 2: Synthesis of Carboxyl-containing Acrylic Resin

[0083] In a four-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, nitrogen gas was introduced, and 325.0 grams of diethylene glycol dimethyl ether was added, heated to 110 ° C, and then 204.0 grams of methacrylic acid and benzyl acrylate were added. 81.0 grams, 77.0 grams of methyl methacrylate, 302.0 grams of solvent propylene glycol methyl ether acetate, and the mixture of 12.0 grams of synthetic catalyst peroxide 1,1-dimethylethyl-2-ethyl peroxyhexanoate , drop it into the system uniformly in about 3 hours, then keep it at 110°C for 3 hours, wait for the deactivation of the peroxide, and obtain the polymer. After the resin is cooled, add 289.0 grams of Nantong Xinnaxi S-100 , 3.0 grams of phosphorus triphenylide, and 0.08 grams of polymerization inhibitor 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl free radicals were added, the temperature was raised to 100 ° C, and...

Synthetic example 3

[0084] Synthesis Example 3: Synthesis of Modified Polyimide

[0085]In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.0 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15.0 grams of γ-butyrolactone, and stir Evenly, add polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 50.0 grams (0.05 moles), dimethylolpropionic acid 3.3 grams (0.025 moles) and γ-butyrolactone 30 grams, for this The solution was heated to 80° C., and after 10 hours, a uniform and transparent polymer liquid was obtained. Then add 4,4-biphenyl ether dianhydride 15.5g (0.05 moles) and γ-butyrolactone 30.0 grams in this solution, adjust the reaction temperature to 160 ℃ of heating for 2 hours, become uniform light yellow-brown solution, later Lower the temperature in the kettle to 100°C, then add 6.5 grams (0.05 moles) of hydroxyethyl methacrylate and 6.7 grams of γ-butyrolactone to the reaction system, keep stirring at a temperat...

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PUM

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Abstract

The invention discloses a white photosensitive film, and a preparation method and application thereof. The white photosensitive film comprises a white inorganic filler, alkali-soluble resin, light-cured resin, a photoinitiator, heat-cured resin, a curing agent and an antioxidant; and the curing agent is an anhydride curing agent. A white photosensitive film formula is used to form a coating liquid, a carrier film is coated with the coating liquid, and the carrier film is heated and baked to obtain the white photosensitive film. According to the white photosensitive film, the formula is improved, and by adding the anhydride curing agent and the alkali-soluble resin with the side chain and/or the tail end containing a carboxyl group, the prepared white photosensitive cover film can meet therequirements of an existing product in the aspects of development precision, high temperature resistance and the like; and the cured film is low in b value and high in reflectivity.

Description

technical field [0001] The invention relates to the technical field of white solder resist ink, in particular to a white photosensitive film and its preparation method and application. Background technique [0002] Today, in order to protect printed circuit boards under conditions such as reflow soldering, high temperature, and high humidity, cover films and solder assembly inks are widely used as protective films. If it is a white solder resist ink, it must not only have good developing precision, resistance to tin bleaching, and resistance to various chemical reagents and other characteristics of general solder resist inks, but also be photosensitive and heat-cured without obvious yellowing. It is also very important to maintain a high reflectivity. Especially the white soldering ink used on the surface of the printed circuit board equipped with LED chips, its main purpose is to effectively emit the light of various bands emitted by the LED through this white film, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027
Inventor 金行洲刘驰洲
Owner SHANGHAI FUSAITE NEW MATERIAL
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