Surface microstructure array with anti-icing performance and forming method thereof

Abstract

The invention discloses a surface microstructure array with the anti-icing performance and a forming method thereof. A single microstructure of the surface microstructure array is of a flower-shaped structure and is made of photosensitive resin, the sizes of receptacle, filament and anther parts of the flower-shaped structures are all micron-sized, the distance among the flower-shaped structures is also micron-sized, nano particles are distributed on the surfaces of the microstructures to form a micron / nano composite structure with the flower-shaped structures, and a plurality of composite structures are uniformly distributed on the target surface of a molded part to form the surface microstructure array. According to the forming method of the surface microstructure array, an electromagnetic auxiliary vibration type surface projection micro-stereo lithography system is utilized, and the preparation of the surface microstructure array is completed by following certain steps; according to the surface microstructure array, the icing phenomenon of water drops on the packaging surface of a sensor can be delayed, and the adhesion capacity of ice is reduced; according to the forming method, through high-frequency vibration of an electromagnetic auxiliary vibration device, agglomeration of nano particles is reduced, uniform distribution of the nano particles is achieved, and the forming precision and the forming quality are improved; and a forming system moving platform can horizontally and linearly move in the Y-axis direction and the X-axis direction, so that the area of a forming layer and the size of the molded part are enlarged, the forming time is shortened, and the forming efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of surface modification and 3D printing molding, and in particular relates to a surface microstructure array with anti-icing performance and a molding method thereof. Background technique [0002] In recent years, photoelectric sensors have been widely used in industrial automation control, sensing machines and devices, involving visual inspection, precision measurement, positioning sensing and other fields. However, in the actual application process, photoelectric sensors face various harsh environments, such as high (low) temperature, high humidity, shock, vibration, corrosion, etc. Among them, if the photoelectric sensor is exposed to an environment with high humidity and low temperature for a long time, the surface of the photoelectric sensor package will freeze, which will seriously interfere with the work of the photoelectric sensor and affect the accuracy, reliability and sensitivity of the sensor. T...

AI Technical Summary

Problems solved by technology

However, in the actual application process, photoelectric sensors face various harsh environments, such as high (low) temperature, high humidity, shock, vibration, corrosion, etc.

Among them, if the photoelectric sensor is exposed to an environment with high humidity and low temperature for a long time, the surface of the photoelectric sensor package will freeze, which will seriously interfere with the work of the photoelectric sensor and affect the accuracy, reliability and sensitivity of the sensor.

The traditional anti-icing and de-icing methods are mainly mechanical de-icing, air-heat de-icing and electric de-icing, etc., which not only cannot meet the requirements of modern lightweight and economical design, but also easily aggravate the thermal fatigue and mechanical fatigue of parts, thereby reducing the sensor Overall Security and Reliability

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