Novel oxygen-free packaging method of integrated circuit
A packaging method and integrated circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of difficult anaerobic packaging, cumbersome methods, high process requirements, etc., and achieve the effect of improving the curing effect and accelerating the curing process
Active Publication Date: 2020-09-25
中山市东翔微电子有限公司
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Problems solved by technology
[0004] However, the existing integrated circuits tend to have air remaining in the plastic packaging compound on the package, and the oxygen in the air has the risk of oxidizing the circuit during the operation of the integrated circuit. The conventional vacuum pumping method is not only cumbersome but also requires high technology. And in the process of injecting the plastic encapsulant, there will still be a small amount of air trapped in it, making it difficult to truly realize oxygen-free encapsulation
Method used
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Embodiment 1
[0045] see Figure 1-2 , a novel oxygen-free encapsulation method for an integrated circuit, comprising the steps of:
[0046] S1. Electroplating on the carrier substrate 1 to form wire bonding pins 3, and forming an insulating layer on the non-active surface of the integrated circuit board 2, and then mounting the integrated circuit board 2 on the carrier substrate 1;
[0047] S2, electrically connecting the electrodes on the active surface of the integrated circuit board 2 to the welding wire pin 3 through the wire 4;
[0048] S3. Install the oxygen-consuming heating net between the four mounting blocks 6 set on the carrier substrate 1, and close the mold 5 after ensuring stability;
[0049] S4. After preheating the plastic sealing compound, slowly inject the plastic sealing compound from the injection port on the mold 5 until it is flush;
[0050] S5. After waiting for 5-10 minutes to consume the oxygen in the molding compound by the oxygen-consuming heating network, inje...
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The invention discloses a novel oxygen-free packaging method of an integrated circuit, and belongs to the technical field of circuit packaging. According to the present invention, an oxygen consumption heating network can be embedded in the packaging process of the integrated circuit, the oxygen in an oxygen-consuming heating ball is forced to perform internal reaction with the self-heating material by utilizing the heat of the molding compound, and after oxygen is consumed, a vacuum environment is formed inside; then, after the anti-leakage protection layer on the surface is melted, air is actively sucked into the plastic package material, so that the dense filling of the molding compound is ensured. Meanwhile, oxygen in the sucked air continues to react with the self-heating material, the low-pressure environment in the oxygen consumption heating ball can still be kept, and the air in the plastic package material is continuously absorbed. Moreover, in the process of reaction betweenthe self-heating material and oxygen, a large amount of heat can be released and transmitted to the plastic package material, and the curing process of the plastic package material is accelerated, sothat the oxygen-free packaging can be carried out by consuming air in the plastic package material. Meanwhile, heat is provided from the inside to accelerate curing, and the packaging time is greatlyshortened while oxygen-free packaging of an integrated circuit is guaranteed.
Description
technical field [0001] The invention relates to the technical field of circuit packaging, and more specifically, relates to a novel oxygen-free packaging method for integrated circuits. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. The inventors of the integrated circuit are Jack Kilby (germanium (Ge)-based integrated circuits) and Robert Noyce (silicon (Si)-based integra...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/56B29C45/14
CPCH01L21/56B29C45/14819H01L2224/18
Inventor 龚建中
Owner 中山市东翔微电子有限公司