An oxygen-free packaging method for integrated circuits

Abstract

The invention discloses an oxygen-free packaging method for an integrated circuit, which belongs to the technical field of circuit packaging, and can implement an oxygen-consuming heating network embedded in the packaging process of an integrated circuit, and use the heat of the plastic packaging compound to force the oxygen in the oxygen-consuming heating bulb First react internally with the self-heating material, consume oxygen and form a vacuum environment inside, and then start to actively inhale air in the molding compound after the anti-leakage protective layer on the surface melts to ensure the dense filling of the molding compound and at the same time inhale oxygen in the air Continue to react with the self-heating material, still can maintain the low-pressure environment in the oxygen-consuming heating bulb, continue to absorb the air in the molding compound, and the self-heating material will release a large amount of heat during the reaction with oxygen and transfer it to the molding compound , Accelerate the curing process of the molding compound, which can not only consume the air in the molding compound for anaerobic packaging, but also provide heat from the inside to accelerate the curing, ensuring the oxygen-free packaging of integrated circuits and greatly reducing the packaging time.

Description

technical field [0001] The invention relates to the technical field of circuit packaging, in particular to an oxygen-free packaging method for integrated circuits. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. The inventors of the integrated circuit are Jack Kilby (germanium (Ge)-based integrated circuits) and Robert Noyce (silicon (Si)-based integrated circuits). Most o...

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Problems solved by technology

[0004] However, the existing integrated circuits tend to have air remaining in the plastic packaging compound on the package, and the oxygen in the air has the risk of oxidizing the circuit during the operation of the integrated circuit. The conventional vacuum pumping method is not only cumbersome but also requires high technology. And in the process of injecting the plastic encapsulant, there will still be a small amount of air trapped in it, making it difficult to truly realize oxygen-free encapsulation

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