Automatic welding head contact type soldering device

Abstract

The invention relates to an automatic welding head contact type soldering device and relates to the technical field of soldering equipment. The automatic welding head contact type soldering device comprises a rack and a soldering mechanism mounted on the rack; the soldering mechanism comprises a welding head arranged on the rack in a sliding manner; a cleaning mechanism is mounted on the rack andcomprises a cleaning box mounted on the rack and a negative pressure pump mounted on the cleaning box; the negative pressure pump is provided with a negative pressure end and a positive pressure end;a blowing cavity is formed in the cleaning box and is provided with a negative pressure opening communicating with the negative pressure end of the negative pressure pump; an air-jet piece is mountedin the blowing cavity; and a cleaning area capable of blowing to clean the welding head is arranged in the blowing cavity. During the cleaning process, the gas sprayed out by the air-jet piece blows off sundries on the welding head; the negative pressure pump generates suction force to the gas sprayed out by the air-jet piece to prevent the gas of the air-jet piece from overflowing out of the blowing cavity, and the cleaned sundries fall in the blowing cavity or is discharged via the positive pressure end of the negative pressure pump in a unified manner, so that the automatic welding head contact type soldering device can collect and treat the sundries from the welding head through blast cleaning in a unified manner.

Description

technical field [0001] The present application relates to the technical field of soldering equipment, in particular to a soldering iron head contact type automatic soldering device. Background technique [0002] In the electronics industry, various electronic components or materials and plates are often connected by soldering. When soldering, the soldering iron tip used for soldering is controlled at a certain high temperature state, and then the tin wire is melted and attached to the corresponding position of the plate to be soldered. However, because the soldering iron tip is in a high temperature state for a long time, the tin wire of the soldering iron tip contains substances such as flux, which are decomposed by heat, so that the surface of the soldering iron tip is very likely to remain with tin particles and tin oxides and other sundries, which will affect the soldering iron tip. The soldering iron tip will work normally after dipping tin wire and so on. [0003] Th...

AI Technical Summary

Problems solved by technology

However, in the actual cleaning process, the sundries cleaned up by the blower are easily splashed around under the influence of the blowing force of the gas. The splashed sundries may fall on the electronic components and boards and affect the pass rate of the product, and may also splash on the automatic cleaning machine. Other parts of the fuselage of the soldering device require staff to perform additional cleaning work

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