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100W solid-state relay lead frame

A solid-state relay, lead frame technology, applied in the direction of semiconductor/solid-state device components, electric solid-state devices, circuits, etc., can solve the problems of inability to meet the requirements of high-power use, difficult to form glue dispensing, low insulation voltage, etc., to avoid the above problems. Machine failure, improve product sealing layer, increase the effect of insulation voltage

Pending Publication Date: 2020-10-02
WUXI HONGHU MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, the insulation voltage of the input terminal and the coupling terminal is low, it is difficult to form glue during the production process, and the yield is low; in addition, the product has a small heat capacity and poor heat dissipation, and the product cannot meet the requirements of high-power use when it is used at the end.

Method used

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  • 100W solid-state relay lead frame

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Experimental program
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Effect test

Embodiment Construction

[0021] The specific implementation of this embodiment will be described below in conjunction with the accompanying drawings.

[0022] Such as figure 1 As shown, the 100W solid-state relay lead frame of the present embodiment includes a side rib 1, a positioning hole 101 is provided on the side rib 1, and the first, second, third, The fourth and fifth pins 3, 4, 5, 6, 7, the lower ends of the first, second, third, fourth and fifth pins 3, 4, 5, 6, 7 are connected to the side rib 1, the first The upper end of a pin 3 is connected to the first carrier island 8 with a large area. The first carrier island 8 is made of a thick copper strip, and the first carrier island 8 is provided with a silver-plated area 11 for installing switch chips. , four through holes 81 are opened on the first carrier island 8, and the first carrier island 8 is connected to the side rib 1 through four connecting ribs 82, and the upper ends of the adjacent third pin 5 and fourth pin 6 are respectively Con...

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Abstract

The invention relates to a 100W solid-state relay lead frame, which comprises an edge rib. The edge rib is connected with a first pin, a second pin, a third pin, a fourth pin and a fifth pin in sequence from right to left through connecting ribs; the lower ends of the first pin, the second pin, the third pin, the fourth pin and the fifth pin are connected with the edge rib; the upper end of the first pin is connected with a first slide island with a larger area; the first slide island is made of a thick copper strip, and the first slide island is provided with a silver plating area for mounting a switch chip; the upper ends of the adjacent third pin and fourth pin are connected with a second slide island and a third slide island respectively; the second slide island and the third slide island are respectively provided with a silver plating area used for installing a coupling chip and a silver plating area used for installing a photosensitive element; and the upper end of the second pinand the upper end of the fifth pin are respectively provided with a silver plating area. The 100W solid-state relay lead frame meets the requirement for high-power output of products and is high in production efficiency and yield.

Description

technical field [0001] The invention relates to a lead frame, in particular to a 100W solid state relay lead frame. Background technique [0002] As one of the most critical components in semiconductor components and integrated circuit packaging, lead frame plays a role in supporting chips, signal distribution and connecting external circuits. In the existing technology, the insulation voltage of the input terminal and the coupling terminal is low, it is difficult to form glue during the production process, and the yield is low; in addition, the product has a small heat capacity and poor heat dissipation, and the product cannot meet the requirements of high-power use when it is used at the end. Contents of the invention [0003] In view of the above shortcomings, the applicant has conducted research and improvement, and provides a 100W solid state relay lead frame. [0004] The technical scheme adopted in the present invention is as follows: [0005] A 100W solid-state r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/49H01L25/16
CPCH01L23/49H01L23/49503H01L23/49517H01L23/49541H01L23/49568H01L25/167
Inventor 袁宏承
Owner WUXI HONGHU MICROELECTRONICS CO LTD
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