Cermet vertical pin injection molding process for chip packaging
An injection molding, cermet technology, used in metal processing equipment, transportation and packaging, etc., can solve the problems of high injection molding process cost, low density of packaged parts, poor performance of packaged parts, etc., to eliminate unevenness, improve Hardness and compactness, the effect of improving compactness
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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] see figure 1 , the present invention provides a technical solution: a metal ceramic vertical needle injection molding process for chip packaging, comprising the following steps:
[0023] (1) Formula design: design of material formula;
[0024] The ratio of the material formula is carbon: 10.04%-16.04%, peptide: 60.07%-67.07%, nickel 9.00%-11.00%, molybdenum: 7.50%-12.50%, nitrogen: 1.60%-5.20%.
[0025] (2) Ratio of materials: mix titani...
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