Thermopile Manufacturing Process
A production process and technology of thermopile, applied in the field of thermopile, can solve the problems of difficulty in guaranteeing the consistency of single-point parameters and the influence of yield, and achieve the effects of ensuring stability, improving yield and high production efficiency
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Embodiment 1
[0062] Use strip plate as support plate, see appendix Figure 1-4 , the thermopile fabrication process of the present invention comprises the following steps:
[0063] (1) Motherboard production
[0064] The motherboard 7 is composed of a base wire 1 and a support plate 2. The base wire 1 is a constantan wire with a diameter of 0.2mm, and the support plate 2 is an epoxy strip with a size of 400.0mm×12.0mm×6.0mm. The edge of the support plate 2 is provided with a winding groove 3 (about 0.1 mm in depth) and a plating solution isolation groove 4 (about 1.0 mm in depth and about 1.2 mm in width); 3 is wound on the support plate 2, and the two ends of the base wire 1 are respectively drawn out from the base wire lead-out wire fixing holes 5 provided to form the mother board 7; during the winding process, the metal wire is used as a spacer. The part of the base wire 1 to be plated is separated from the support plate 2, and after the winding is completed, the metal wire is removed...
Embodiment 2
[0074] Ring-shaped plate is used as support plate, see appendix Image 6 , the thermopile fabrication process of the present invention comprises the following steps:
[0075] (1) Motherboard production
[0076] The motherboard 7 is composed of a base wire 1 and a support plate 2. The base wire 1 adopts constantan wire with a diameter of 0.2 mm, and the support plate 2 adopts an epoxy ring plate with an outer diameter of 256 mm, an inner diameter of 232 mm and a thickness of 6 mm. The edge of the support plate 2 is provided with a winding groove 3 (about 0.1 mm deep) and a plating solution isolation groove 4 (about 1.0 mm deep and about 2.0 mm wide); the base wire 1 is wound along the winding groove 3. Made on the support plate 2, the two ends of the base wire 1 are respectively drawn out from the base wire lead-out wire fixing holes 5 provided to form a motherboard 7; during the winding process, the base wire is used as a spacer to separate the base wire. The part of the wir...
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Abstract
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