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Thermopile Manufacturing Process

A production process and technology of thermopile, applied in the field of thermopile, can solve the problems of difficulty in guaranteeing the consistency of single-point parameters and the influence of yield, and achieve the effects of ensuring stability, improving yield and high production efficiency

Active Publication Date: 2021-07-20
CHINA INSTITUTE OF ATOMIC ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The point-by-point manufacturing process commonly used at present will consume a lot of manpower and construction time when it involves the production of thermoelectric pairs with a large number of points, and it is difficult to guarantee the consistency of single-point parameters, and the yield rate will also be affected

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Use strip plate as support plate, see appendix Figure 1-4 , the thermopile fabrication process of the present invention comprises the following steps:

[0063] (1) Motherboard production

[0064] The motherboard 7 is composed of a base wire 1 and a support plate 2. The base wire 1 is a constantan wire with a diameter of 0.2mm, and the support plate 2 is an epoxy strip with a size of 400.0mm×12.0mm×6.0mm. The edge of the support plate 2 is provided with a winding groove 3 (about 0.1 mm in depth) and a plating solution isolation groove 4 (about 1.0 mm in depth and about 1.2 mm in width); 3 is wound on the support plate 2, and the two ends of the base wire 1 are respectively drawn out from the base wire lead-out wire fixing holes 5 provided to form the mother board 7; during the winding process, the metal wire is used as a spacer. The part of the base wire 1 to be plated is separated from the support plate 2, and after the winding is completed, the metal wire is removed...

Embodiment 2

[0074] Ring-shaped plate is used as support plate, see appendix Image 6 , the thermopile fabrication process of the present invention comprises the following steps:

[0075] (1) Motherboard production

[0076] The motherboard 7 is composed of a base wire 1 and a support plate 2. The base wire 1 adopts constantan wire with a diameter of 0.2 mm, and the support plate 2 adopts an epoxy ring plate with an outer diameter of 256 mm, an inner diameter of 232 mm and a thickness of 6 mm. The edge of the support plate 2 is provided with a winding groove 3 (about 0.1 mm deep) and a plating solution isolation groove 4 (about 1.0 mm deep and about 2.0 mm wide); the base wire 1 is wound along the winding groove 3. Made on the support plate 2, the two ends of the base wire 1 are respectively drawn out from the base wire lead-out wire fixing holes 5 provided to form a motherboard 7; during the winding process, the base wire is used as a spacer to separate the base wire. The part of the wir...

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Abstract

The invention provides a thermopile manufacturing process, which comprises the following steps: (1) making a motherboard; (2) electroplating; (3) assembling the thermopile. The thermopile manufacturing process of the present invention adopts the electroplating method to prepare thermoelectric junctions, which can realize the single batch molding and manufacturing of multiple thermoelectric junctions, and the number of thermoelectric junctions produced in a single time can be adjusted, and has high thermoelectric junction manufacturing efficiency and good parameter consistency. features. At the same time, due to the adoption of the production process of making the mother board first, and then electroplating and forming; therefore, the damage to the thermoelectric junction caused by the production process of forming the thermoelectric junction first and then assembling the mother board is effectively avoided, and the yield rate is significantly improved. In addition, the metal forming the thermoelectric junction in the electroplating process of the present invention can be supplemented by an equal amount of anode metal dissolution, so the composition of the plating solution does not change due to the electroplating process, ensuring the stability of the plating solution, and the plating solution can be recycled.

Description

technical field [0001] The invention belongs to the field of thermopile, in particular to a thermopile fabrication process. Background technique [0002] Calorimetry can be used to measure the thermal power of various heat-producing samples. It is an NDA analysis method with high accuracy and is widely used in the measurement of chemical energy, biological energy, and radioactive decay energy. Thermopile is the measurement medium of calorimetry - the core component of thermopile calorimeter, which uses Thomson effect to generate thermoelectric potential, effectively converts the heating power of the sample into a measurable thermoelectric potential signal, which can easily realize trace or even trace. Accurate measurement of calorimetric power. The performance of the thermopile is directly related to the measurement limit and accuracy of the calorimeter, and the performance of the thermopile prepared by different processes is significantly different. [0003] A thermopile ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/00G01J5/12
CPCC25D7/00G01J5/12G01J2005/123
Inventor 刘丽飞吕卫星胡石林武超任英
Owner CHINA INSTITUTE OF ATOMIC ENERGY