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High-frequency transmission composite copper foil substrate and preparation method
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A copper foil substrate, high-frequency transmission technology, applied in the direction of circuit substrate materials, chemical instruments and methods, synthetic resin layered products, etc., can solve problems such as poor bonding force, increased copper production cost, and large signal loss
Pending Publication Date: 2020-10-23
SONGYANG ELECTRONICS MATERIAL KUSN
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Problems solved by technology
However, compared with PI, the adhesion between LCP and copper foil is poor, so LCP substrates usually use copper foil with rougher surface and higher Rz value to improve the adhesion strength.
However, due to the skin effect during high-frequency and high-speed transmission, electron transmission tends to be carried out on the surface of copper foil. If the surface is rough, it will cause a large signal loss, and LCP requires special processes and equipment, which improves the Production cost of copper plate
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preparation example Construction
[0039] A method for preparing a high-frequency transmission composite copper foil substrate, comprising the following steps:
[0040] Step 1: providing a copper foil layer with a non-fluorine-modified polyimide layer, and coating a high-frequency insulating mixture on the non-fluorine-modified polyimide layer;
[0041] Step 2: After drying, a high-frequency insulating mixture layer of 6 μm to 25 μm is formed, and then a high-frequency polyimide layer is coated on the high-frequency insulating mixture layer to obtain a single-sided copper foil substrate;
[0042] Step 3: Coating a high-frequency insulating mixture on the high-frequency polyimide layer of the single-sided copper foil substrate, and forming a high-frequency insulating mixture layer of 6 μm to 25 μm after drying;
[0043] Step 4: Laminate another copper foil layer with a non-fluorine-modified polyimide layer on the high-frequency insulating mixture layer, and form a tightly bonded double-sided copper foil through ...
Embodiment
[0051] Embodiment: below are concrete embodiment of the present invention and comparative example, and test result thereof, see table 2 and table 3:
[0052] Table 2:
[0053]
[0054] table 3:
[0055]
[0056] Embodiments 2, 4, 7, 8, and 10 are single-sided copper foil substrates, and the preparation method is as follows:
[0057] Step 1: providing a copper foil layer with a non-fluorine-modified polyimide layer, and coating a high-frequency insulating mixture on the non-fluorine-modified polyimide layer;
[0058] Step 2: After drying, a high-frequency insulating mixture layer is formed, and then a high-frequency polyimide layer is coated on the high-frequency insulating mixture layer to obtain a single-sided copper foil substrate;
[0059] Wherein the thickness of the copper foil in Examples 2, 4, 7, 8, and 10 is 12 μm.
[0060] Embodiments 1, 3, 5, 6, and 9 are double-sided copper foil substrates, and the preparation method is as follows:
[0061] Step 1: providi...
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Abstract
The invention relates to a high-frequency transmission composite copper foil substrate. The substrate comprises at least one single-layer plate and a high-frequency polyimide layer, wherein the single-layer plate comprises a copper foil layer, a non-fluorine modified polyimide layer and a high-frequency insulating mixture layer which are arranged in sequence; the high-frequency polyimide layer isbonded to the high-frequency insulation mixture layer; the non-fluorine modified polyimide in the non-fluorine modified polyimide layer is formed by modifying thermosetting polyimide with a non-fluorine polymer compound; and the high-frequency insulating mixture in the high-frequency insulating mixture layer is formed by mixing thermoplastic polyimide and high-frequency resin. An insulating adhesive layer is formed by compounding the non-fluorine modified polyimide layer, the high-frequency insulating mixture layer and the high-frequency polyimide layer, and the copper foil substrate meeting the 5G high-frequency high-speed transmission requirement is obtained.
Description
technical field [0001] The invention relates to a copper foil substrate, in particular to a high-frequency transmission composite copper foil substrate and a preparation method thereof. Background technique [0002] Liquid CrystalPolymer (LCP) for short. It is a new type of high-performance special engineering plastic developed in the early 1980s. FPC, also known as flexible circuit board, is a highly reliable and extremely flexible printed circuit board made of flexible copper clad laminate (FCCL). It has high wiring density, light weight, thin thickness, and bending Sexual characteristics. The application of flexible boards involves almost all electronic products, such as ribbon leads of hard drives, automotive electronics, cameras, digital cameras, instruments and meters, office automation equipment, medical equipment and other fields. LCP is widely used for its superior electrical properties The field of flexible circuit boards. However, compared with PI, the adhesi...
Claims
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