High-frequency transmission composite copper foil substrate and preparation method
A copper foil substrate, high-frequency transmission technology, applied in the direction of circuit substrate materials, chemical instruments and methods, synthetic resin layered products, etc., can solve problems such as poor bonding force, increased copper production cost, and large signal loss
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[0039] A method for preparing a high-frequency transmission composite copper foil substrate, comprising the following steps:
[0040] Step 1: providing a copper foil layer with a non-fluorine-modified polyimide layer, and coating a high-frequency insulating mixture on the non-fluorine-modified polyimide layer;
[0041] Step 2: After drying, a high-frequency insulating mixture layer of 6 μm to 25 μm is formed, and then a high-frequency polyimide layer is coated on the high-frequency insulating mixture layer to obtain a single-sided copper foil substrate;
[0042] Step 3: Coating a high-frequency insulating mixture on the high-frequency polyimide layer of the single-sided copper foil substrate, and forming a high-frequency insulating mixture layer of 6 μm to 25 μm after drying;
[0043] Step 4: Laminate another copper foil layer with a non-fluorine-modified polyimide layer on the high-frequency insulating mixture layer, and form a tightly bonded double-sided copper foil through ...
Embodiment
[0051] Embodiment: below are concrete embodiment of the present invention and comparative example, and test result thereof, see table 2 and table 3:
[0052] Table 2:
[0053]
[0054] table 3:
[0055]
[0056] Embodiments 2, 4, 7, 8, and 10 are single-sided copper foil substrates, and the preparation method is as follows:
[0057] Step 1: providing a copper foil layer with a non-fluorine-modified polyimide layer, and coating a high-frequency insulating mixture on the non-fluorine-modified polyimide layer;
[0058] Step 2: After drying, a high-frequency insulating mixture layer is formed, and then a high-frequency polyimide layer is coated on the high-frequency insulating mixture layer to obtain a single-sided copper foil substrate;
[0059] Wherein the thickness of the copper foil in Examples 2, 4, 7, 8, and 10 is 12 μm.
[0060] Embodiments 1, 3, 5, 6, and 9 are double-sided copper foil substrates, and the preparation method is as follows:
[0061] Step 1: providi...
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