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Micro-tweezers imitating the surface structure of ant mouthparts mandible and its testing and preparation device and method

A technology of testing device and placing table, which is applied in the direction of packaging, transportation and packaging, conveyor objects, etc., can solve problems such as complex conditions, chip damage, etc., and achieve the effect of improving position accuracy and ensuring positioning accuracy

Active Publication Date: 2021-11-23
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conditions of vacuum clamping are relatively complicated, and the contact surface between the chip and the vacuum suction head is required to be very smooth, and the vacuum clamping method will cause damage to the chip due to excessive adsorption force during the chip picking process.

Method used

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  • Micro-tweezers imitating the surface structure of ant mouthparts mandible and its testing and preparation device and method
  • Micro-tweezers imitating the surface structure of ant mouthparts mandible and its testing and preparation device and method
  • Micro-tweezers imitating the surface structure of ant mouthparts mandible and its testing and preparation device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] like figure 1 and 2 As shown, the hair-clip micro-tweezers imitating the surface of the ant's mouthparts mandible include a tweezers main body 1 and two hair-clamping components 2 . Two wool-type clamping assemblies 2 are respectively arranged inside the clamping parts 1-1 of the two clamping arms on the tweezers main body 1, and are used to contact with the chip and play the role of clamping the chip. The wool-type clamping assembly 2 includes a fiber bearing sheet 2-2 and a fiber bundle group 2-3 with striped transverse microstructures. The strip-like microstructure includes a plurality of fiber embedding grooves arranged on the fiber bearing sheet and arranged at equal intervals in turn. Fiber bearing sheet 2-2 adopts copper sheet. Fiber bundle groups 2-3 consist of a plurality of fiber bundles. The inner end of each fiber bundle is embedded in the strip-shaped microstructure of the fiber bearing sheet 2-2, and the outer end is suspended. The fiber bundles are a...

Embodiment 2

[0049] like image 3 As shown, a clamping and positioning accuracy test device for hair clip type micro-tweezers includes a base plate 4 , a clamping module 5 and a chip lifting module 6 . The gripping module 5 is used for installing the hair clip type micro-tweezers 3 to be tested. The hair clip type micro tweezers 3 is the hair clip type micro tweezers 3 imitating the surface of the ant mouthparts mandible described in embodiment 1. The clamping module 5 includes a first lifting slide, a clamping driving assembly (5-1~5-2) and a fixing part 5-3. The chip lifting module 6 includes a second lifting slide, a workbench 6 - 1 and a regularizing assembly 7 . The first lifting slide table and the second lifting slide table have the same structure, and both include a carriage, a leading screw, a slide block, a lifting motor, an upper limit sensor 8 , a lower limit sensor 9 and a shading sheet 10 . The upper limit sensor 8 and the lower limit sensor 9 both adopt slot-type photoele...

Embodiment 3

[0063] like Image 6 As shown, the device for preparing the hair clip type micro-tweezers 3 described in Example 1 includes a fiber transfer mechanism, a fiber feeding component and an embedded fiber component.

[0064] The fiber feeding assembly comprises a feeding frame 13, a feeding pipe 14, a feeding wheel 15, a sensor 16 in place, and a cutting assembly (not shown on the figure). In place sensor 16 adopts photoelectric sensor, and the model is ZX1-LD50A81. Feeding frame 13 is fixed on the frame. The junction of the two feeding wheels 15 is located at the output end of the feeding pipe 26 . The ends of the coiled or strip-shaped fiber bundles pass through the feeding pipe 14 and pass through the junction of the two feeding wheels 15 . The two feeding wheels 15 are driven by a limiting feeding motor and gears to rotate in opposite directions at a constant speed, so that the fiber bundles passing through the feeding pipe 14 can be continuously output. A cutting member (d...

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Abstract

The invention discloses micro-tweezers which imitate the surface structure of ant's mouthparts mandible, a test preparation device and a method thereof. Picking and packaging of microchips has always been a difficult problem in the electronic packaging industry. The hair-clip micro-tweezers of the present invention include a tweezers main body and two hair-type clamping components. The two hair clamping assemblies are respectively arranged on the clamping parts of the two clamping arms on the tweezers main body. The Wool clamp assembly consists of a copper sheet and a carbon fiber set. The fiber bundle group consists of a plurality of carbon fibers. Each carbon fiber is arranged at intervals in turn, and the inner end is fixed to the clamping part of the clamp arm corresponding to the clamp arm. From the perspective of bionics, the present invention, through the observation and study of the fibers on the surface of the ant's mouthparts, finds that during the process of picking up the microchip by the fiber, it can overcome the problem of difficult release of the microchip due to the adhesion of the microchip and tweezers during the release process. , and because the fiber is a flexible fiber, the microchip will not be damaged when the microchip is clamped.

Description

technical field [0001] The invention belongs to the technical field of micro-device operation, and in particular relates to a hair clip type micro-tweezers imitating the surface of an ant's mouthparts mandible, a micro-tweezers testing device, a micro-tweezers preparation device and a method. Background technique [0002] Picking and packaging of microchips has always been a difficult problem in the electronic packaging industry. In recent years, in order to obtain lighter, smaller, and thinner electronic products, the miniaturization of semiconductor chips has become a trend. Therefore, the difficulty of picking up and packaging chips has further increased. Ordinary chips are usually transferred directly by clamping with tweezers, but microchips are relatively fragile. During the process of clamping with tweezers, it is easy to cause damage to the chip, and in the process of releasing the microchip, due to the influence of scale effect , the gravitational force of the chip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90B65B35/16
CPCB65B35/16B65G47/90
Inventor 倪敬韩立栋郑军强蔡均崔智
Owner HANGZHOU DIANZI UNIV