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Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device

A technology of resin composition and compound, which is applied in semiconductor devices, synthetic resin layered products, semiconductor/solid-state device manufacturing, etc., can solve problems such as workability deterioration and achieve excellent flux activity

Active Publication Date: 2020-11-27
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the miniaturization and high performance of semiconductor devices, the narrowing of the pitch of the electrodes arranged on the chip and the narrowing of the gaps between the electrodes are progressing, and the deterioration of workability and failure due to the prolonged filling of the underfill material Occurrence of poor filling such as filling becomes a problem

Method used

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  • Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device
  • Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device
  • Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0215] PHENOLITE (registered trademark) KA-1163 (trade name, mass average molecular weight (Mw): 4600, softening point: 105 to 115° C., 5% mass reduction temperature: 298° C., 60 parts by mass (30 parts by mass in terms of non-volatile content) of MEK solution (50% by mass of non-volatile content) of cresol novolak type phenolic resin, produced by DIC Co., Ltd., 1 -(4-tert-butylphenyl)-3-(4-methoxyphenyl)-1,3-propanedione (manufactured by Tokyo Chemical Industry Co., Ltd.) 30 parts by mass, as a radical polymerizable compound (C ) R in the aforementioned formula (1) 1 are hydrogen atoms, n 1 40 parts by mass of a maleimide compound (BMI-2300, manufactured by Daiwa Chemical Industry Co., Ltd.) of 1 to 3 (50% by mass of non-volatile components) by mass (20 parts by mass in terms of non-volatile components), Represented by the aforementioned formula (2) as the second radically polymerizable compound (C), n 2 40 parts by mass of a maleimide compound (BMI-1000P, manufactured by ...

Embodiment 2

[0217] As the compound (A) having a phenolic hydroxyl group, it was changed to TBIS (registered trademark)-MP (trade name, 9,9'-bis-(4-hydroxy-3-methylphenyl)fluorene, molecular weight: 378, melting point : 225° C., 5% mass reduction temperature: 313° C., produced by Taoka Chemical Industry Co., Ltd.) MEK solution (50% by mass of non-volatile components) 60 parts by mass (30 parts by mass in terms of non-volatile components), except Except that, a varnish was prepared in the same manner as in Example 1, and a resin laminate was obtained.

Embodiment 3

[0219] As the metal ion scavenger (B), change to (E,E')-1,7-bis(4-hydroxy-3-methoxyphenyl)-1,6-heptadiene-3,5-di A varnish was prepared in the same manner as in Example 1 except that 30 parts by mass of ketone (manufactured by Tokyo Chemical Industry Co., Ltd.), and a resin laminate was obtained.

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Abstract

Provided is a resin composition suitable for pre-applied underfill material having an excellent flux activity, flexibility, and storage stability. This resin composition contains a compound (A) havinga phenolic hydroxy group, a metal ion scavenger (B), and a radical polymerizable compound (C).

Description

technical field [0001] The present invention relates to a resin composition, a laminate using the resin composition, a semiconductor wafer with a resin composition layer, a semiconductor mounting substrate with a resin composition layer, and a semiconductor device. Specifically, the present invention relates to a resin composition useful as an underfill material. Background technique [0002] In recent years, with the miniaturization and high performance of semiconductor devices, as a method of mounting a semiconductor chip (hereinafter, sometimes simply referred to as a "chip") on a semiconductor mounting substrate (hereinafter, sometimes simply referred to as a "substrate"), flip-chip Chip mounting gets a lot of attention. In flip-chip mounting, there is generally the following process: after bonding the chip to the substrate, filling the gap between the chip and the substrate with an underfill material and curing it. However, with the miniaturization and high performanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F222/40B32B27/30C08K3/013C08K5/07C08K5/3432C08K5/3492C08L39/04H01L21/60H01L23/29H01L23/31
CPCC09D4/00H01L23/293H01L21/563C09D4/06C09D151/08C08F283/00C08F222/40C08K5/07C08F2/44C08K5/3432C08K5/3492C08K3/013C08L39/04C08L33/00H01L23/29H01L23/31C08L51/08H01L23/295
Inventor 冈庭正志泷口武纪东口鉱平木田刚
Owner MITSUBISHI GAS CHEM CO INC