Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device
A technology of resin composition and compound, which is applied in the direction of semiconductor devices, synthetic resin layered products, semiconductor/solid device manufacturing, etc., and can solve problems such as inability to obtain joints
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Embodiment 1
[0218] Methyl ethyl ketone (hereinafter, sometimes abbreviated as "MEK") of N,N'-bis(salicylidene)-1,2-propanediamine (manufactured by Tokyo Chemical Industry Co., Ltd.) as a chelated flux (A) ) solution (20 parts by mass in terms of non-volatile components), dicumyl peroxide (manufactured by Kishida Chemical Co., Ltd., 10-hour half-life temperature: 116.4° C.) as a thermal radical polymerization initiator (B) 0.5 parts by mass, R in formula (3) as the first radically polymerizable compound (C) 8 All hydrogen atoms, n 1A MEK solution (8 parts by mass in terms of non-volatile content) of a maleimide compound (BMI-2300, manufactured by Daiwa Chemical Industry Co., Ltd.) of 1 to 3, as the second radically polymerizable compound ( C) MEK solution (25 parts by mass in terms of non-volatile content) of a maleimide compound (BMI-1000P, manufactured by K.I Chemical Industry Co., LTD.), as a third radically polymerizable compound (C) MEK solution of bis-(3-ethyl-5-methyl-4-maleimide ...
Embodiment 2
[0220] As the chelated flux (A), 20 parts by mass of N,N'-bis(salicylidene)-1,3-propanediamine (manufactured by Tokyo Chemical Industry Co., Ltd. ) except that, a varnish was prepared in the same manner as in Example 1, and a laminate was obtained.
Embodiment 3
[0222] As the thermal radical polymerization initiator (B), bis(2-tert-butylperoxyisopropyl)benzene (Perbutyl P, manufactured by NOF Corporation, 10-hour half-life temperature: 119.2°C) was used, and the amount used was changed to Except 0.5 mass parts, the varnish was prepared similarly to Example 1, and the laminated body was obtained.
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Abstract
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