Low-junction-temperature solar diode welding agent
A technology of solar energy and diodes, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as low oxidation resistance, poor activity, and increased flux concentration
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Embodiment 1
[0011] Embodiment one: low-junction temperature solar diode soldering agent, by weight percentage, is made up of 65% metal powder and 35% flux, and described metal powder is by weight percentage by the lead of 92.5%, 44.% tin, 3 % silver and 0.1% indium, the flux contains 35% masson rosin, 7% malonic acid, 3% tartaric acid, 7% benzotriazole, 3% hydrogenated castor oil, Surplus is organic solvent, and organic solvent comprises tetrahydrofurfuryl alcohol and triethylene glycol butyl ether, and the mass percent of each composition in described organic solvent is,
[0012] Tetrahydrofurfuryl alcohol 35%-44%
[0013] Triethylene glycol butyl ether 56%-65%.
[0014] After adopting the above scheme, the metal powder configured in proportion can make the solder have better wettability and ductility, soften the texture and reduce stress damage, have excellent anti-oxidation ability, reduce the leakage current of the surface electric field, and can also reduce the use temperature , im...
Embodiment 2
[0015] Embodiment two: low junction temperature solar diode soldering agent, by weight percentage, is made up of 70% metal powder and 30% flux, and described metal powder is by weight percentage by the lead of 92.5%, 44.% tin, 3 % silver and 0.1% indium, and the flux contains 45% masson rosin, 3% malonic acid, 7% tartaric acid, 3% benzotriazole, and 7% hydrogenated castor oil by weight. Surplus is organic solvent, and organic solvent comprises tetrahydrofurfuryl alcohol and triethylene glycol butyl ether, and the mass percent of each composition in described organic solvent is,
[0016] Tetrahydrofurfuryl alcohol 45%-50%
[0017] Triethylene glycol butyl ether 50%-55%.
[0018] After adopting the above scheme, the metal powder configured in proportion can make the solder have better wettability and ductility, soften the texture and reduce stress damage, have excellent anti-oxidation ability, reduce the leakage current of the surface electric field, and can also reduce the use...
Embodiment 3
[0019] Embodiment three: low-junction temperature solar diode soldering agent is characterized in that: by weight percentage, is made up of 68% metal powder and 32% flux, and described metal powder is by weight percentage by the lead of 92.5%, 44.% Tin, 3% silver and 0.1% indium, the composition contained in the flux is disproportionated rosin 40%, malonic acid 6%, tartaric acid 4%, phenylacryltriazole 5%, hydrogenated castor Sesame oil 5%, the balance is organic solvent, and organic solvent comprises tetrahydrofurfuryl alcohol and triethylene glycol butyl ether, and the mass percent of each composition in described organic solvent is,
[0020] Tetrahydrofurfuryl alcohol 46-48%
[0021] Triethylene glycol butyl ether 52-54%.
[0022] After adopting the above scheme, the metal powder configured in proportion can make the solder have better wettability and ductility, soften the texture and reduce stress damage, have excellent anti-oxidation ability, reduce the leakage current o...
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