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High density ball grid array (BGA) package capacitor design

A ball grid array and capacitor technology, applied in capacitors, electric solid devices, circuits, etc.

Inactive Publication Date: 2020-12-08
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The real estate on the bottom side of a BGA package is limited by the typically dense array of contact balls

Method used

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  • High density ball grid array (BGA) package capacitor design
  • High density ball grid array (BGA) package capacitor design
  • High density ball grid array (BGA) package capacitor design

Examples

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Embodiment Construction

[0018] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. It will be apparent, however, to one of ordinary skill in the art that the disclosed embodiments may be practiced without some of these specific details. In other instances, well-known structures and techniques have not been shown in detail in order not to obscure the disclosure.

[0019] The systems disclosed herein relate to integrated circuit packaging. More specifically, the systems disclosed herein provide a packaging solution for integrated circuits, adding capacitance on the "bottom" side of the package to support high frequency and high current operating conditions.

[0020] Modern large integrated circuit devices such as application-specific integrated circuits (ASICs) and general-purpose processors can operate at high frequency, high power specifications, requiring additional capacitive resources coupled to the...

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Abstract

A circuit package is provided that includes a substrate having a first side and a second side, an integrated circuit component coupled to the second side of the substrate, and a ball grid array formedon the first side of the substrate, the ball grid array including multiple contact balls arranged in a pattern. Each of a first subset of the contact balls is electrically coupled to a first voltageinput of an integrated circuit component, and each of a second subset of the contact balls is electrically coupled to a second voltage input of the integrated circuit component. The package also includes a capacitor mounted to the first side and having a first terminal coupled to a first contact ball in the first subset of the contact balls and a second terminal coupled to a second contact ball inthe second subset of the contact balls.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation of U.S. Patent Application No. 16 / 370,073, filed March 29, 2019, which claims the benefit of U.S. Provisional Patent Application No. 62 / 767,922, filed November 15, 2018, all of which are Incorporated herein by reference. Background technique [0003] A Ball Grid Array (BGA) is a type of packaging for integrated circuits with a large number of interconnects. The BGA package includes a plurality of electrical contacts on the bottom side for providing an electrical connection between the integrated circuit and a printed circuit board (PCB) on which the BGA package is mounted. Contacts take the form of solder balls or "contact balls" on copper pads on the bottom side of the BGA package. The contact balls supply voltage and power to the integrated circuit and provide paths for electrical signals to travel to and from the integrated circuit. The available area on the top side of a BGA pack...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/50
CPCH01L23/147H01L23/49816H01L23/49838H01L23/50H01L28/40H01L2924/1433H01L2924/15311H01L2924/19106H05K1/0231H05K1/181H05K3/3436H05K2201/10015H05K2201/10159H05K2201/1053H05K2201/10734Y02P70/50H01L23/48H01L23/488H01L23/498H01L23/528H01L23/5286H01L23/538H01L23/5386H01L23/58H01L23/642H01L24/14H01L24/17H01L24/18H01L24/25H01L25/18H01L27/0288H01L27/0629H01L27/0733H01L2924/1205H01L2924/381
Inventor 斯科特·柯克曼
Owner GOOGLE LLC
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