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Ceramic plate binding force pull-off test method

A testing method and binding force technology, applied in the direction of measuring devices, instruments, and mechanical devices, etc., can solve the problems of non-quantitative determination of the bonding force between the substrate and the coating, poor reproducibility of test results, and cumbersome testing process, etc., to achieve easy implementation , high accuracy and simple detection method

Pending Publication Date: 2020-12-15
山东司莱美克新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After the ceramic plate is copper-plated, during the pull-off bonding force test, the ceramic is often broken before the film is pulled off due to the fragile characteristics of the ceramic, and the ceramic copper-plated plate is tested by traditional methods such as exposure, development, and etching. The method of copper-plating squares on ceramic plates is time-consuming and labor-intensive. In addition, the existing detection methods can only qualitatively or semi-qualitatively measure the bonding force of the coating, but cannot quantitatively measure the bonding force between the substrate and the coating. Therefore, it is necessary to explore a method that can both qualitatively and quantitatively detect the bonding force of the ceramic copper-clad plate coating.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027]The method for testing the adhesion pull-off of the ceramic plate described in Example 1 consists of the following steps:

[0028](1) Cut squares of a certain size on the ceramic copper-plated plate, and ensure that each cut square can be cut to the ceramic substrate to obtain a ceramic copper-plated plate test sample;

[0029](2) Brush the copper layer on the other side of the ceramic copper-plated test sample with solder paste, and then press the entire surface of the ceramic copper-plated test sample with the copper foil;

[0030](3) Heat the pressed ceramic copper-plated plate test sample and copper foil at a constant temperature of 240°C. After the solder paste is melted, take the pressed ceramic copper-plated plate test sample and copper foil to lower the temperature. The ceramic copper-plated plate test sample and the copper foil are completely bonded together to prepare test sample A;

[0031](4) Place the test sample A on the tensile platform of the peeling tester and fix it;

[003...

Embodiment 2

[0046]The method for testing the adhesion pull-off of the ceramic plate described in Example 2 consists of the following steps:

[0047](1) Cut squares of a certain size on the ceramic copper-plated plate, and ensure that each cut square can be cut to the ceramic substrate to obtain a ceramic copper-plated plate test sample;

[0048](2) Brush the copper layer on the other side of the ceramic copper-plated test sample with solder paste, and then press the entire surface of the ceramic copper-plated test sample with the copper foil;

[0049](3) Heat the pressed ceramic copper plate test sample and copper foil at a constant temperature at 255°C. After the solder paste is melted, take the pressed ceramic copper plate test sample and copper foil to lower the temperature. The ceramic copper-plated plate test sample and the copper foil are completely bonded together to prepare test sample A;

[0050](4) Place the test sample A on the tensile platform of the peeling tester and fix it;

[0051](5) Weld one...

Embodiment 3

[0065]The method for testing the bonding force pull-off of the ceramic plate described in Example 3 consists of the following steps:

[0066](1) Cut squares of a certain size on the ceramic copper-plated plate, and ensure that each cut square can be cut to the ceramic substrate to obtain a ceramic copper-plated plate test sample;

[0067](2) Brush the copper layer on the other side of the ceramic copper-plated test sample with solder paste, and then press the entire surface of the ceramic copper-plated test sample with the copper foil;

[0068](3) Heat the pressed ceramic copper-plated plate test sample and copper foil at a constant temperature at 248°C. After the solder paste is melted, take the pressed ceramic copper-plated plate test sample and copper foil to lower the temperature. The ceramic copper-plated plate test sample and the copper foil are completely bonded together to prepare test sample A;

[0069](4) Place the test sample A on the tensile platform of the peeling tester and fix it...

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Abstract

The invention belongs to the technical field of coating testing methods, and particularly relates to a ceramic plate binding force pull-off testing method. The method comprises the steps: cutting outa square block with a certain size from a ceramic copper-plated plate to obtain a ceramic copper-plated plate detection sample; brushing soldering paste on the copper layer on the other side of the ceramic copper-plated plate detection sample, and then pressing the ceramic copper-plated plate detection sample and a copper foil together; carrying out heating at a constant temperature of 240-255 DEGC, taking down the ceramic copper-plated plate detection sample after the soldering paste is molten, and cooling to prepare a detection sample A; placing the detection sample A on a tension platformof a stripping testing machine, and fixing the detection sample A; welding one end of a tension copper wire to the detection sample A, and fixing the other end of the tension copper wire to a stripping testing machine stretching device; and starting a tensile program of the stripping testing machine, and carrying out pull-off test on the film layer to obtain the binding force. The ceramic plate binding force pull-off test method can quantitatively and qualitatively detect the binding force of the ceramic copper-plated plate coating, and the detection method is simple and easy to implement.

Description

Technical field[0001]The invention belongs to the technical field of plating test methods, and specifically relates to a method for testing the bonding force of a ceramic plate.Background technique[0002]Material surface engineering technology has been widely used in modern society. Coating on the surface of materials is an important method for surface modification of materials. In this technology, the bonding force between the coating and the substrate is used to characterize the material. An important indicator of surface treatment effect.[0003]The current testing methods for the force between the coating and the substrate mainly include the following: Bending method: The bending method is suitable for testing the bonding force between the coating and the substrate after the linear, filament, and sheet substrates are coated. Fully qualitative detection method; thermal shock method: heat the coated sample in a box-type resistance furnace for 30-60min, and then cool it in air or room...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 乔利杰宋述兵王瑞俊王博
Owner 山东司莱美克新材料科技有限公司
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