Test method and equipment for silicon photonics chip

Abstract

The invention provides a test method and equipment for a silicon photonics chip, which cuts the silicon photonics wafer after fixing the silicon photonics wafer on a flexible film, and the relative position of the silicon photonics chip obtained after cutting does not change. Then move the silicon photonic chip and flexible film to the test equipment for testing, without placing the silicon photonic chip multiple times and aligning the relative position of the silicon photonic chip. The test method of the silicon photonic chip of the present invention omits the steps of placing the silicon photonic chip multiple times and aligning the silicon photonic chip before testing, greatly shortens the test time, and greatly improves the test efficiency.

Description

technical field [0001] The invention relates to the field of photoelectric testing, in particular to a testing method and equipment for a silicon optical chip. Background technique [0002] Typically, silicon photonics chips require light as an input source or output source to test the optical or optoelectronic performance of optical devices or circuits. [0003] A common way to couple light into and out of a silicon photonics chip is to use a grating coupler. A grating coupler is set on the top of the silicon photonic chip, and the optical fiber is located above the silicon photonic chip. The light transmitted by the fiber is coupled into or out of the optical waveguide of the silicon photonic chip through the grating coupler. However, grating couplers have disadvantages such as high optical coupling loss and large wavelength dependence. [0004] Another common way to couple light into or out of a silicon photonic chip is to use a fiber optic end-face coupler. The side of...

AI Technical Summary

Problems solved by technology

[0005] When testing a silicon photonic chip, the optical fiber needs to be coupled with the fiber end-face coupler from the side of the silicon photonic chip, so the side of the silicon photonic chip with the fiber end-face coupler cannot be blocked, which leads to the silicon photonics with the fiber end-face coupler Chips can only be tested at chip level or bar level

The disadvantage is that it takes time to pick, place and align each chip or each strip, the test efficiency is low, and the test time is long

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