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High speed / low power server farms and server networks

A server group and server technology, applied in the direction of impedance network, multi-terminal pair network, single-port active network, etc., can solve undisclosed technology, undisclosed and other problems

Pending Publication Date: 2020-12-18
皮尔 L 德罗什蒙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] U.S. Patent Application No. 7,405,698 to de Rochemont, entitled "Ceramic Antenna Modules and Methods of Making Same" (the '698 application), discloses the use of high dielectric constant electroceramics to form Transmission lines of the characteristic impedance of the input / output impedance of a semiconductor chip, and the integration of those transmission lines on the surface of a semiconductor die or an electrical interconnection (interposer), but it does not disclose techniques related to transmission lines containing along High permittivity and high relative permeability dielectrics for transmission line path configurations that make the transmission line resonant for a given frequency or desired clock speed, it also does not disclose incorporating passive circuitry within the transmission line close to vias within the chip stack or apply those devices within a server farm

Method used

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  • High speed / low power server farms and server networks
  • High speed / low power server farms and server networks
  • High speed / low power server farms and server networks

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Embodiment Construction

[0084] The invention has been described illustratively with reference to the disclosed embodiments. Various modifications and changes to the disclosed embodiments may be made by those skilled in the art without departing from the scope of the invention as defined in the appended claims.

[0085]This application incorporates by reference U.S. Patent No. 7,405,698 to de Rochemont, entitled "Ceramic Antenna Module and Method of Manufacturing Same" (the '698 application), U.S. Patent Application No. 8,715,839 to de Rochemont, filed on U.S. Patent No. 8,350,657 to de Rochemont, filed June 30, 2006, entitled "Electronic Components and Methods of Manufacturing Same" ('839 application), filed January 6, 2007, and entitled "Power U.S. Patent (“657 Application”), de Rochemont’s U.S. Serial No. 14 / 560,935, filed December 4, 2014, entitled “Power Management Module and Method of Manufacture” US Patent ('935 application), de Rochemont, US Serial No. 13 / 216,192, entitled "Power FET with Res...

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Abstract

A server farm has servers with at least one hybrid computing module operating at a system clock speed that optimally matches the intrinsic clock speed of a semiconductor die embedded within a high speed semiconductor chip stack or mounted upon the semiconductor carrier.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Patent Application No. 62 / 666,124, filed May 3, 2018 and incorporated herein in its entirety. technical field [0003] The present invention generally relates to the design and construction of server farms with high computing speed and high power efficiency in a small physical space, wherein the higher computing speed, smaller physical space and higher power efficiency are achieved by Produced by removing the printed circuit board from the microelectronic assembly. [0004] The invention additionally relates to a power management stage that introduces power savings within a server farm or a network of server farms. [0005] The present invention relates generally to the design and construction of server farms and regional or global networks of server farms linked together with high speed / high power efficient optical, wireless and satellite telecommunications systems. [0006] The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12B82Y30/00H01G4/30H01L23/532H01L23/64
CPCH01L23/64H01L23/66H01L25/04H01F1/36H01F3/14H01F27/2895H01F2027/348H03H11/42H03H11/485H03H11/53G06F15/78Y02D10/00G06F1/324H01F27/346H01F27/36H01F38/42G05B9/02
Inventor 皮尔·L·德罗什蒙
Owner 皮尔 L 德罗什蒙