Preparation method of damp-heat-resistant low-temperature reinforced transparent conductive composite film
A transparent conductive, low-temperature strengthening technology, used in equipment for manufacturing conductive/semiconducting layers, cable/conductor manufacturing, circuits, etc., can solve problems such as peeling, loose film, and many defects
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[0028] Below in conjunction with embodiment technical solution of the present invention will be described in further detail:
[0029] In this embodiment, the material of the target for depositing the oxide strengthened film layer and the semi-metallic transition layer is ITO, IZO, AZO, GIZO or FIO; the metal target for depositing the metal layer 4 is Ag, Cu, Al, Fe, Mn or Gr; the material of the substrate 1 is glass;
[0030] The steps of the method for preparing a low-temperature reinforced transparent conductive composite film resistant to heat and humidity by adopting the technical solution of the present invention are as follows:
[0031] Step 1. Ultrasonic cleaning of the substrate 1 with acetone, petroleum ether and degreaser solution for 5 minutes to 120 minutes, then cleaning with absolute ethanol for 5 minutes to 120 minutes, and finally cleaning with deionized water for 5 minutes to 30 minutes, and drying the surface with clean air The remaining water vapor, then pl...
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