Multilayer capacitor capable of realizing lead bonding and manufacturing method

A multilayer capacitor and wire bonding technology, applied in the field of capacitors, can solve the problems of fragile devices, reduced device reliability, and high brittleness of ceramics.

Inactive Publication Date: 2020-12-25
GUANGZHOU AURORA TECHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Improve the relative permittivity of the capacitor ceramic medium; but usually sacrifice the dielectric properties such as temperature stability, which cannot meet the requirements;
[0005] 2. Increase the effective area of ​​the electrode of the capacitor; most of them use a multi-layer ceramic capacitor (Multi-layer Ceramic Capacitors, MLCC) structure to increase the effective area of ​​the electrode, but it is not suitable for wire bonding or embedded assembly
[0006] 3. Reduce the thickness of the dielectric layer of the capacitor; on the one hand, due to the high brittleness of ceramics, too small thickness will cause the device to be fragile and the assembly process will be difficult; on the other hand, as the thickness decreases, the breakdown voltage of the device will also increase accordingly. Decrease, reduce the reliability of the device, the practical application is of little significance

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  • Multilayer capacitor capable of realizing lead bonding and manufacturing method
  • Multilayer capacitor capable of realizing lead bonding and manufacturing method
  • Multilayer capacitor capable of realizing lead bonding and manufacturing method

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] The object of the present invention is to provide a wire-bonded multilayer capacitor and a manufacturing method thereof, which improve the capacity density of the capacitor.

[0037] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] figure 1 It is a struc...

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Abstract

The invention relates to a multilayer capacitor capable of realizing lead bonding and a manufacturing method. The multilayer capacitor comprises a first end electrode, a plurality of first inner electrode layers, a plurality of second inner electrode layers, a plurality of dielectric layers and a second end electrode; the first inner electrode layers and the second inner electrode layers are alternately stacked in sequence, and the dielectric layers are arranged between the first inner electrode layers and the second inner electrode layers; the first end electrode and the second end electrodeare electrode plates, each first inner electrode layer is connected with the first end electrode, and each second inner electrode layer is connected with the second end electrode. By setting the thickness of the dielectric layers, the number of the dielectric layers and the areas of the first inner electrode layers and the second inner electrode layers, the capacitor with high capacitance can be obtained, the mechanical strength of the capacitor is improved by the multilayer dielectric layers, and the capacitor is enabled to have relatively good mechanical strength while the capacitor is ensured to have high capacitance.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a wire-bonded multilayer capacitor and a manufacturing method. Background technique [0002] With the rapid development of modern electronic technology, electronic machines and electronic equipment are developing in the direction of miniaturization, high speed, high reliability, low cost and low power consumption. The micro-assembly process will gradually replace the traditional insertion, welding, surface mount and other processes, and the key lies in the bonding of components. Wire bonding technology can meet the needs of reducing circuit board size, improving device integration, expanding circuit board functions, and reducing costs. As one of the three major passive components, capacitors play an important role in electronic circuits. [0003] At present, in order to increase the capacity density of capacitors, there are mainly the following three methods: [0004] 1. Im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/005H01G13/00
CPCH01G4/005H01G4/1209H01G4/30H01G13/006
Inventor 刘福扩杨俊锋钟建平
Owner GUANGZHOU AURORA TECHNOLOGIES CO LTD
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