Device and method capable of carbonizing plurality of tantalum sheets simultaneously

A tantalum sheet and carbonization temperature technology, which is applied in the field of semiconductor material preparation, can solve problems such as unfavorable product tracking, inability to distinguish the carbonization of tantalum sheets, etc., and achieves the effects of low processing difficulty, simple structure and high carbonization efficiency.

Active Publication Date: 2021-01-01
哈尔滨科友半导体产业装备与技术研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned shortcomings that the existing tantalum sheet carbonization device cannot distinguish the carbonization of the tantalum sheet before and after carbonization, and is not conducive to product tracking, the present invention provides a device that can simultaneously carbonize multiple tantalum sheets

Method used

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  • Device and method capable of carbonizing plurality of tantalum sheets simultaneously
  • Device and method capable of carbonizing plurality of tantalum sheets simultaneously
  • Device and method capable of carbonizing plurality of tantalum sheets simultaneously

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specific Embodiment approach 1

[0030] Specific implementation mode one: reference figure 1 , figure 2 Describe this embodiment, this embodiment proposes the following technical solutions:

[0031] A device capable of simultaneously carbonizing multiple tantalum sheets, comprising: a crucible body 1, a crucible upper cover 2, a tantalum sheet bracket 3, an insulation layer pad 4 and an insulation layer shell 5, the crucible body 1 is concave, and It is composed of a crucible shell 101 and a crucible bottom 102. A plurality of tantalum sheet brackets 3 are stacked in the crucible body 1. The tantalum sheet brackets 3 are concave and numbered on the outer wall, and the inner wall of the tantalum sheet bracket 3 is processed. There is a boss 301 for placing the tantalum sheet 6, the tantalum sheet bracket 3 is made of graphite material, the crucible upper cover 2 is covered on the crucible body 1, so that the crucible body 1 and the crucible upper cover 2 form a closed structure, and the heat preservation Th...

specific Embodiment approach 2

[0039] Specific implementation mode two: reference image 3 , figure 2 Describe this embodiment, this embodiment proposes the following technical solutions:

[0040] A device capable of carbonizing multiple tantalum sheets at the same time, comprising: a crucible body 1, a crucible upper cover 2, a tantalum sheet bracket 3, an insulation layer pad 4 and an insulation layer shell 5, the crucible body 1 is concave, multiple A tantalum sheet bracket 3 is stacked in the crucible body 1. The tantalum sheet bracket 3 is concave and engraved with a number on the outer wall. The inner wall of the tantalum sheet bracket 3 is processed with a boss 301 for placing the tantalum sheet 6, The sheet bracket 3 is made of graphite material, and the crucible upper cover 2 is covered on the crucible body 1, so that the crucible body 1 and the crucible upper cover 2 form an airtight structure, and the insulating layer pad 4 has the same bottom area as the crucible body 1, The crucible body 1 i...

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Abstract

The invention relates to a device capable of carbonizing tantalum sheets, and belongs to the technical field of semiconductor material preparation. The device and the method aim to overcome the defectthat an existing tantalum sheet carbonization device cannot distinguish the tantalum sheet carbonization conditions before and after carbonization. The device capable of carbonizing the plurality oftantalum sheets simultaneously comprises a crucible body, a crucible upper cover, tantalum sheet brackets, an insulating layer cushion block and an insulating layer shell; and the tantalum sheet brackets are arranged in the crucible body in a stack mode, numbers are engraved on the outer walls of the tantalum sheet brackets, bosses are machined on the inner walls of the tantalum sheet brackets, the crucible upper cover covers the crucible body, and the insulating layer cushion block and the insulating layer shell are arranged outside the crucible body in a sleeving mode. The method capable ofcarbonizing the plurality of tantalum sheets simultaneously comprises the steps that carbon powder and the tantalum sheets are placed into the tantalum sheet brackets according to the sequence of thecarbon powder, the tantalum sheets and the carbon powder, the crucible upper cover is covered, the insulating layer is placed, heating is conducted, and the tantalum sheets are carbonized for a certain period of time at a certain carbonization temperature. The tantalum sheets are distinguished through the marks on the tantalum sheet brackets, and whether tantalum sheet carbonization reaches the standard or not is observed by comparing the weights of the tantalum sheets before and after carbonization.

Description

technical field [0001] The invention belongs to the technical field of semiconductor material preparation, and in particular relates to a device and a method for a tantalum carbide sheet. Background technique [0002] AlN single crystal has the largest forbidden band width, the highest breakdown field strength, high thermal conductivity, good thermal and chemical stability among all direct bandgap semiconductor materials, and has broad application prospects in the fields of microelectronics and optoelectronics. It has become a research hotspot at home and abroad and has attracted much attention. At present, the most commonly used methods for preparing AlN single crystal substrates are HVPE (halide vapor phase epitaxy) and PVT (physical vapor transport). For AlN HVPE growth equipment, due to the strong corrosiveness of aluminum halides (AlCl, AlCl3, etc.) and the high operating temperature (usually greater than 1400 ° C), the construction of HVPE equipment is difficult, cost...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C8/64C30B25/18C30B29/40
CPCC23C8/64C30B25/18C30B29/403Y02E50/10
Inventor 不公告发明人
Owner 哈尔滨科友半导体产业装备与技术研究院有限公司
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