Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Combined Electrochemical Deposition-Electrolytic Machining Method Based on Mask Electric Field Confinement

A combined processing and electrochemical technology, applied in the field of combined electrochemical deposition and electrolytic processing based on mask electric field constraints, can solve problems such as poor surface quality, and achieve the effect of protecting equipment, improving processing efficiency, and avoiding high-level corrosion.

Active Publication Date: 2021-12-28
NANJING TECH UNIV
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the parts electroformed by this method have the problems of recasting layer and poor surface quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Combined Electrochemical Deposition-Electrolytic Machining Method Based on Mask Electric Field Confinement
  • Combined Electrochemical Deposition-Electrolytic Machining Method Based on Mask Electric Field Confinement
  • Combined Electrochemical Deposition-Electrolytic Machining Method Based on Mask Electric Field Confinement

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0047] The embodiment of the present invention discloses a combined electrochemical deposition-electrolysis processing method based on mask electric field constraints. This method is applied to the surface of micro-sized parts of various miniaturized and miniaturized equipment in the fields of aerospace, national defense and military industry, and advanced medical equipment. Microstructure processing, the surface microstructure of such tiny parts has complex shape and structure, high forming precision, small surface roughness, no microcracks and internal stress, and special surface is required in acid-base, high temperature, high pressure and other occasions. Performance, traditional processing methods cannot meet this requirement,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a combined electrochemical deposition-electrolytic processing method based on mask electric field constraints, the method includes making an array hole corresponding to the structure of the mask plate on the film on the surface of the workpiece; connecting the fixture with an external power supply to make the tool electrode as an anode , connect the transmission roller to an external power supply and use the workpiece as a cathode for microstructure electrochemical deposition; when the power deposition working time is over, connect the fixture to an external power supply to make the tool electrode as a cathode, and connect the transmission roller to an external power supply to make the workpiece as an anode for electrolytic finishing. Remove the redundant metal deposited on the surface of the workpiece; when the working time of the electrolysis of the power supply is over, take out the workpiece, place the workpiece in absolute ethanol, and use ultrasonic cleaning to clean the film on the surface of the workpiece. The invention combines electrochemical deposition and electrolytic finishing for processing, removes redundant metal layers on the surface after electrochemical deposition, ensures the processing accuracy of the electrodeposited microstructure, and meets the processing requirements of various tiny parts.

Description

technical field [0001] The invention relates to the technical field of special processing, in particular to a mask-based electric field-constrained electrochemical deposition-electrolysis combined processing method. Background technique [0002] With the rapid development of science and technology, miniaturized and miniaturized equipment and tiny-sized parts are increasingly used in aerospace, national defense, advanced medical equipment and other fields. These tiny parts can reach micron-level feature scales, complex shapes and structures, High forming precision, small surface roughness, no micro-cracks and internal stress, and special surface properties are required in acid-base, high temperature, high pressure and other occasions, so traditional additive manufacturing methods are difficult to meet processing requirements. [0003] In recent years, special processing methods for micro-sized parts have been greatly developed, such as EDM deposition, chemical vapor depositio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23H5/00C25D5/02
CPCB23H5/00C25D5/022
Inventor 张彦吴传冬王国乾唐健杨炆縚
Owner NANJING TECH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com