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A method for preparing flexible electronic/quantum circuits from liquid metal

A liquid metal and electronic circuit technology, which is applied in metal material coating technology, ion implantation plating, vacuum evaporation plating, etc., can solve problems such as difficult resolution and complex mask preparation process, and achieve simple and easy preparation methods Effect

Active Publication Date: 2022-06-28
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to control the line width and line spacing of flexible electronic circuits through the mask plate. The preparation process of the mask plate is complicated, and it is difficult to achieve a resolution of several microns in line width and line spacing.

Method used

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  • A method for preparing flexible electronic/quantum circuits from liquid metal
  • A method for preparing flexible electronic/quantum circuits from liquid metal

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] In this embodiment, the flexible substrate PDMS is used as the substrate material, and the liquid metal uses GaIn alloy. The specific method is as follows: figure 1 shown.

[0027] Step 1: Use 60×40mm PDMS to prepare multiple electrodes on a flexible substrate by photolithography, and then stretch 100% along the length direction, the length becomes 120mm, and the width becomes 30mm.

[0028] Step 2: Put the stretched flexible substrate on the substrate of the thermal evaporation equipment, use 4 ml of liquid metal droplets as the evaporation source, and under vacuum conditions (10 -4 Pa), a liquid metal film composed of micro-nano-scale liquid metal spheres was obtained on the stretched substrate by depositing by vacuum thermal evaporation technology for 5 min.

[0029] Step 3: Under vacuum conditions, restore the PDMS strain to 0%, and restore the PDMS to a length of 60 mm and a width of 40 mm.

[0030] Step 4: The liquid metal balls are rearranged. In the stretching...

Embodiment 2

[0032] In this embodiment, the flexible substrate PDMS is used as the substrate material, and the liquid metal uses GaIn alloy. The specific method is as follows: figure 1 shown.

[0033] Step 1: Use 60×40mm PDMS to prepare multiple electrodes on a flexible substrate by photolithography, and then stretch 100% along the length direction, the length becomes 120mm, and the width becomes 30mm.

[0034] Step 2: Put the stretched flexible substrate on the substrate of the thermal evaporation equipment, use 4 ml of liquid metal droplets as the evaporation source, and under vacuum conditions (10 -4 Pa), a liquid metal film composed of micro-nano-scale liquid metal spheres was obtained on the stretched substrate by depositing by vacuum thermal evaporation technology for 5 min.

[0035] Step 3: Break the vacuum. Under atmospheric conditions, the micro-nano-sized liquid metal sphere first spontaneously forms an oxide layer, and then restores the PDMS strain to 0%, and the PDMS is restor...

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Abstract

The present invention relates to the field of flexible electronics, and discloses a method for preparing flexible electronics / quantum circuits from liquid metal, including steps: (1) using photolithography technology to prepare electrodes on a flexible substrate, and then pulling the flexible substrate along the direction of the electrodes (2) adopting vacuum thermal evaporation to deposit a liquid metal film on the flexible substrate surface after step (1) stretching; (3) under vacuum conditions, the flexible substrate after stretching recovers the original length, and the liquid metal film The liquid metal balls are arranged along the stretching direction to form an electronic circuit; or, under air conditions, the stretched flexible substrate returns to its original length, and the liquid metal balls of the liquid metal film are arranged along the stretching direction to form a quantum circuit. The method can be used to obtain micron-scale electronic circuit arrays or quantum circuit arrays, and has potential applications in the miniaturization and integration of flexible electronics.

Description

technical field [0001] The invention relates to the field of flexible electronics, in particular to a method for preparing flexible electronics / quantum circuits from liquid metal. Background technique [0002] With the continuous development of electronic science and technology and the improvement of living standards, people have put forward new requirements for electronic devices in daily life, to meet the requirements of equipment deformation, in a certain range of deformation (bending, folding, torsion, compression or tension) Electronic equipment that can still work under extended conditions without damaging its own electronic performance. At present, organic / inorganic material electronic devices are generally fabricated on flexible / extensible substrates (such as plastics, thin metal substrates, etc.) to achieve flexible display, flexible storage, flexible energy storage, flexible sensing, flexible circuits, etc. There are broad application prospects. [0003] While fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/20C23C14/02C23C14/54
CPCC23C14/24C23C14/20C23C14/028C23C14/54
Inventor 刘宜伟王盛丁李润伟范炜
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI