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Flexible composite cover plate and manufacturing method thereof

A production method and flexible technology, applied in the field of flexible display terminal accessories, can solve the problems of high material cost, high composition cost, and thick material thickness of CPI film, so as to reduce energy consumption, high process applicability, and eliminate scratches Effect

Pending Publication Date: 2021-01-12
CHENGDU TOMI SHUANG DU OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current technology development mainly focuses on transparent polyimide (CPI) film and ultra-thin glass (UTG<100um), but a single technology cannot meet people's requirements for flexible covers, so UTG / CPI composite covers board becomes the current compromise choice
[0003] According to the preparation technical characteristics of UTG / CPI composite cover plate, it can be roughly divided into film-coating type and coating type. Among them, the film-covering type uses optically clear adhesive (OCA) as a binder to attach the CPI film to the surface of UTG. The preparation method has the advantages of simple process and low equipment cost, but the defects are also obvious, such as the high cost of incoming materials for CPI film, and the thickness of the product is limited by the thickness of incoming materials and complex structure; while the coating method is based on the precursor of CPI The material is transparent polyamic acid (CPAA) solution as raw material, coated on the surface of UTG and imidized to obtain CPI film, which has the advantages of good adhesion, bending resistance, flexible design of film thickness according to product requirements and thinner overall thickness of the product. However, the disadvantages are high equipment cost and complex process. The biggest problem is that the process temperature of CPAA imidization often needs to be higher than 300°C, and this temperature is unbearable for the adhesive that provides the necessary support for UTG during the process. of

Method used

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  • Flexible composite cover plate and manufacturing method thereof
  • Flexible composite cover plate and manufacturing method thereof
  • Flexible composite cover plate and manufacturing method thereof

Examples

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Effect test

Embodiment 1

[0069] 1) The 50um thick ultra-thin glass (UTG) attached to the glass slide is cleaned with cleaning agent and pure water ultrasonically in sequence, and then the surface is treated with air plasma until the water drop angle is less than 5°. Use 5% KH550 in isopropanol (IPA) solution to evenly treat the surface of the UTG, and bake it on a hot plate at 110°C for 5 minutes.

[0070] 2) Spray evenly a polyamic acid solution (CPAA) with a solid content of 6wt% on the surface of the pretreated UGT, bake it on a hot plate at 130°C for 5 minutes, and then dip it into a chemical imidization solution at 65°C for 60 minutes , blow dry at 65°C with an air knife, and move to 180°CN 2 Bake in the oven for 15 minutes to complete the removal of the solvent and the imidization of CPAA to obtain a CPI film with a thickness of 5um. alkane solution to obtain ultra-thin glass with a transparent polyimide layer (CPI)

[0071] 3) Utilize air plasma to treat the surface of the transparent polyimi...

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Abstract

The invention discloses a flexible composite cover plate and a manufacturing method thereof. The flexible composite cover plate at least comprises ultra-thin glass and a transparent polyimide layer formed on the ultra-thin glass, and the transparent polyimide layer is formed by conducting composite imidization treatment on a transparent polyamide acid layer smeared on the ultra-thin glass, whereinthe composite imidization treatment comprises low-temperature thermal imidization treatment and chemical imidization treatment which are carried out in sequence. The technological process is free ofa high-temperature manufacturing procedure, energy consumption is effectively reduced, the technological applicability is high, part of the imidization process is carried out in a solution, and particle pollution can be effectively avoided; the cross-cut tester adhesive force of each film layer is as high as 5B, the surface hardness is greater than 5H, and the bending resistance and the impact resistance are relatively strong; and besides, the invention further discloses a structure of the flexible composite cover plate with a black ink pattern layer and a preparation method of the flexible composite cover plate, that is, the black ink pattern is printed on the surface of the transparent polyimide layer, so that the risk that the printing screen plate is in direct contact with the ultrathin glass to scratch the ultrathin glass is eliminated.

Description

technical field [0001] The present invention relates to the technical field of flexible display terminal accessories, and more specifically, relates to a flexible composite cover formed by compounding ultra-thin glass and transparent polyimide and a manufacturing method thereof. Background technique [0002] As the interactive interface of the flexible display terminal, the flexible cover must not only provide the necessary protection for the display terminal, but also have the characteristics of high visible light transmittance, comfortable hand feeling, high surface hardness and strong bending resistance. The current technology development mainly focuses on transparent polyimide (CPI) film and ultra-thin glass (UTG<100um), but a single technology cannot meet people's requirements for flexible covers, so UTG / CPI composite covers The board has become the current compromise choice. [0003] According to the preparation technical characteristics of UTG / CPI composite cover ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C17/34C03C17/42C03C17/32
CPCC03C17/34C03C17/3405C03C17/42C03C17/32C03C2218/11C03C2218/112C03C2218/32C03C2218/151C03C2218/119C03C2218/365C03C2217/73C03C2217/78C03C2217/70
Inventor 韦新颖李欢乐张磊李晟洙
Owner CHENGDU TOMI SHUANG DU OPTOELECTRONICS CO LTD
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