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Self-repairing heat-conducting epoxy resin composite material and preparation method and application thereof

A technology of epoxy resin and composite materials, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems such as lack of research, achieve the effects of reducing resource waste, high thermal conductivity, and improving stability

Inactive Publication Date: 2021-01-12
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the self-repair research of thermally conductive polymer composites mainly focuses on the recovery of mechanical strength (CN106336664A), and there is a lack of relevant research on the repair of thermal conduction pathways after damage

Method used

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  • Self-repairing heat-conducting epoxy resin composite material and preparation method and application thereof
  • Self-repairing heat-conducting epoxy resin composite material and preparation method and application thereof
  • Self-repairing heat-conducting epoxy resin composite material and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] This embodiment provides a self-healing thermally conductive epoxy resin composite material containing DA bonds with a filling amount of 60 wt% BN (relative to the cured epoxy resin), which is prepared by the following preparation method.

[0052] (1) Preparation of self-healing epoxy resin containing DA bonds

[0053] Add 38 parts by weight of E51 type epoxy resin and 10 parts by weight of furfurylamine into 48 parts by weight of dioxane, react for a period of time at 30°C, and then heat up to 70°C to continue the reaction to obtain a compound with a furan side group with a suitable molecular weight. The linear object is denoted as FLER. When curing, a bismaleimide-based curing agent is added to generate a DA reversible bond through the reaction between the imide and the furyl group.

[0054] figure 1 It is the infrared spectrogram of FLER in embodiment 1 and bismaleimide cured product. It can be seen from the figure that the wavenumber in the spectrogram is 1774cm ...

Embodiment 2

[0061] This embodiment provides a self-healing thermally conductive epoxy resin composite material containing DA bonds with a 40 wt% BN filling amount (relative to the cured epoxy resin). Prepared by the following preparation method.

[0062] (1) Preparation of self-healing epoxy resin containing DA bonds

[0063] The preparation method of the self-healing epoxy resin containing DA bonds is the same as in Example 1.

[0064] (2) Preparation of 40wt% BN filling (relative to epoxy resin cured product) self-healing thermally conductive epoxy resin composite material containing DA bond

[0065] 40 parts by weight of FLER epoxy resin containing 50 wt% dioxane solvent and 4.75 parts by weight of bis(3-ethyl-5-methyl-4-maleimidophenyl)methane were mixed and stirred for 0.5h, After adding 9.9 parts by weight of BN, an appropriate amount of solvent was added and stirring continued for 5 h. After the materials are evenly mixed, continue to sonicate for 20 minutes, and finally put the...

Embodiment 3

[0070] This embodiment provides a self-healing thermally conductive epoxy resin composite material containing DA bonds with a filling amount of 20 wt% BN (relative to the cured epoxy resin). Prepared by the following preparation method.

[0071] (1) Preparation of self-healing epoxy resin containing DA bonds

[0072] The preparation of the self-healing epoxy resin containing DA bonds is the same as in Example 1.

[0073] (2) Preparation of self-healing thermally conductive epoxy resin composite material containing DA bond with 20wt% BN filling amount (relative to epoxy resin cured product)

[0074] 40 parts by weight of FLER epoxy resin containing 50 wt% dioxane solvent and 4.75 parts by weight of bis(3-ethyl-5-methyl-4-maleimidophenyl)methane were mixed and stirred for 0.5h, After adding 4.95 parts by weight of BN, an appropriate amount of solvent was added and stirring continued for 5 hours. After the materials are evenly mixed, continue to sonicate for 20 minutes, and fi...

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Abstract

The invention relates to a self-repairing heat-conducting epoxy resin composite material and a preparation method and application thereof. The self-repairing heat-conducting epoxy resin composite material comprises 100 parts of epoxy resin containing reversible covalent bonds and 5-60 parts of a heat-conducting filler. The self-repairing heat-conducting epoxy resin composite material provided by the invention is relatively high in heat conductivity and good in mechanical property, the composite material still has excellent heat-conducting property and mechanical strength after damage repair, the service life of the composite material can be effectively prolonged, the stability of the composite material is improved, resource waste is reduced, and the composite material conforms to the development trend of global low-carbon economy.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic components, and in particular relates to a self-repairing heat-conducting epoxy resin composite material and a preparation method and application thereof. Background technique [0002] With the miniaturization, high density, and high power of electronic devices, it is easy to generate and accumulate a large amount of heat during use, resulting in shortened service life and performance deterioration of electronic devices. Therefore, the demand for thermal interface materials is increasing. [0003] For most amorphous polymers, phonons are the main carrier of heat transport, and the large number of micro-defects in amorphous polymers will cause severe phonon scattering, resulting in lower thermal conductivity. Therefore, it is usually necessary to add high thermal conductivity fillers to the polymer matrix, and build a thermal conduction path in the composite material to impro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K3/38C08K3/22C08K3/34C08G59/14C08G59/40C08L63/00C08G59/42C08G59/24C09K5/14
CPCC08G59/1438C08G59/1477C08G59/223C08G59/24C08G59/4042C08G59/4215C08K3/22C08K3/34C08K3/38C08K2003/2227C08K2003/385C08L63/00C08L2205/025C08L2205/03C09K5/14
Inventor 容敏智陈芳张泽平章明秋
Owner SUN YAT SEN UNIV