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A kind of micro-nano powder modified active solder and preparation method thereof

A technology of active solder and powder modification, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of uneven thickness of solder layer and thermal damage of diamond, achieve small strength loss and improved mechanical properties , The effect of improving processing efficiency and service life

Active Publication Date: 2022-02-22
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] The present invention provides a micro-nano powder modified active solder and a preparation method thereof, the purpose of which is to effectively solve the above-mentioned thermal damage caused by high-temperature brazing of Ni-Cr alloy to diamond, and the serious Cu-Sn-Ti alloy solder Flowing leads to problems such as uneven thickness of the solder layer, so as to improve the processing efficiency and service life of brazed diamond tools

Method used

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  • A kind of micro-nano powder modified active solder and preparation method thereof
  • A kind of micro-nano powder modified active solder and preparation method thereof
  • A kind of micro-nano powder modified active solder and preparation method thereof

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preparation example Construction

[0034] A method for preparing active solder modified by micro-nano powder, comprising the following steps:

[0035] Step 1), taking 80-99 parts of the solder body and 1-10 parts of the micro-nano powder according to the parts by mass;

[0036] Take 1-2 parts when the micro-nano powder uses defective graphene; take 5-10 parts when the micro-nano powder uses Cu-Ce alloy, take 4-8 parts when the micro-nano powder uses TiC powder, and use Take 1-10 parts of the composite powder of defective graphene and Cu-Ce alloy; the brazing filler metal body adopts Ni-Cr alloy brazing filler metal or Cu-Sn-Ti alloy brazing filler metal;

[0037] Step 2), ball milling the micro-nano powder to make the particle size less than 20 μm;

[0038] Specifically, when the micro-nano powder uses defective graphene, the particle size is less than 20 μm after ball milling, and structural defects appear in more than 50% of the defective graphene area; when the micro-nano powder uses Cu–Ce alloy, the partic...

Embodiment 1

[0057] Step 1), taking 90 parts of Ni-Cr alloy solder and 8 parts of Cu-Ce alloy according to the mass parts;

[0058] Step 2), the Cu-Ce alloy is ball milled to make the particle size less than 20 μm, the vibration frequency of the vibratory ball mill is 30 Hz, the working amplitude is 7 mm, the speed of the ball mill is 30 r / min, the vibration ball milling time is 3 h, the ball-to-material ratio is 1:1, the ball The total volume of powder and powder is 80% of the volume of the ball mill tank, and the ball mill tank and balls are made of wear-resistant ceramic materials;

[0059] Step 3), using dimethylamide to completely disperse and dissolve the Cu-Ce alloy after ball milling to obtain a mixed solution A, the weight ratio of dimethylamide to Cu-Ce alloy is 1:10;

[0060] Step 4), mix the mixed solution A in the dispersant solution evenly, then add the Ni-Cr alloy solder to fully mix and evenly dry, and then obtain the active solder modified by micro-nano powder; in the disp...

Embodiment 2

[0062] Step 1), taking 80 parts of Ni-Cr alloy solder and 10 parts of Cu-Ce alloy according to the mass parts;

[0063] Step 2), the Cu-Ce alloy is ball milled, the vibration frequency of the vibration ball mill is 10Hz, the working amplitude is 10mm, the speed of the ball mill is 20r / min, the vibration ball milling time is 6h, the ball-to-material ratio is 1:2, and the total volume of the ball and powder is 75% of the volume of the ball mill, the ball mill and the ball are made of wear-resistant ceramics;

[0064] Step 3), using liquid paraffin to completely disperse and dissolve the ball-milled Cu-Ce alloy to obtain mixed solution A, the weight ratio of liquid paraffin to Cu-Ce alloy is 1:10;

[0065] Step 4), mix the mixed solution A in the dispersant solution evenly, then add the Ni-Cr alloy solder to fully mix and evenly dry, and then obtain the active solder modified by micro-nano powder; in the dispersant solution The dispersant is sodium lauryl sulfate, the weight rat...

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Abstract

The invention discloses a micro-nano powder modified active solder and a preparation method thereof, belonging to the technical field of brazing materials. Wherein the parts by weight of the solder are 80-99 parts, micro-nano powder 1-10 parts, the micro-nano powder is evenly adsorbed on the surface of the solder, and the diamond tool prepared by the active solder modified by the micro-nano powder, its The number of diamond pits on the surface and the number of microcracks on or around the diamond are greatly reduced, the strength loss of the solder alloy layer is small, the mechanical properties of the diamond are increased by more than 8%, the processing performance of the tool is improved, and the damage caused by high temperature brazing to the diamond can be avoided. Thermal damage, severe flow of Cu–Sn–Ti alloy solder lead to uneven thickness of solder layer, etc., in order to improve the processing efficiency and service life of brazed diamond tools. The micro-nano powder-modified active solder provided by the invention can reduce thermal damage to diamond caused by high-temperature brazing, has the characteristics of low strength loss of the solder alloy layer, and is suitable for making high-performance diamond tools.

Description

technical field [0001] The invention belongs to brazing diamond tool materials, in particular to a micronano powder modified active solder and a preparation method thereof. Background technique [0002] Brazed diamond tools have a strong bonding force due to the chemical metallurgical reaction between the active solder and the diamond, and the exposed height of the diamond can reach 50% to 70% of its own height, so it has high abrasive holding strength, large chip space, With the characteristics of high grinding efficiency and low grinding specific energy, it has shown excellent performance unmatched by traditional diamond tools in high-efficiency and heavy-duty processing of difficult-to-machine materials. [0003] At present, the commonly used solders for preparing brazed diamond tools are mainly Ni–Cr alloy or Cu–Sn–Ti alloy solder. With the gradual popularization and application of brazed diamond tools, some problems have also been exposed during use. For example, high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/36
CPCB23K35/302B23K35/362
Inventor 段端志韩枫林启敬李常胜孙林蒋庄德
Owner XI AN JIAOTONG UNIV
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